CONN CARD EDGE SKT 140 POS 0.8MM SOLDER ST SMD EDGE RATE™ TRAY
| Part | Contact Finish | Gender | Mounting Type | Card Type | Contact Type | Number of Positions | Contact Material | Color | Number of Rows | Number of Positions/Bay/Row [custom] | Features | Card Thickness | Card Thickness | Pitch [x] | Pitch [x] | Material - Insulation | Contact Finish Thickness | Contact Finish Thickness | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Read Out |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | Female | Surface Mount | Non Specified - Dual Edge | Cantilever | 140 | Beryllium Copper | Black | 2 | 70 | Board Guide Solder Retention | 0.062 in | 1.57 mm | 0.8 mm | 0.031 in | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | Dual |
Samtec Inc. | Gold | Female | Surface Mount | Non Specified - Dual Edge | Cantilever | 140 | Beryllium Copper | Black | 2 | 70 | Board Guide | 0.062 in | 1.57 mm | 0.8 mm | 0.031 in | Liquid Crystal Polymer (LCP) | 30 Áin | 0.76 Ám | -55 °C | 125 °C | Solder | Dual |
Samtec Inc. | Gold | Female | Surface Mount | Non Specified - Dual Edge | Cantilever | 140 | Beryllium Copper | Black | 2 | 70 | 0.062 in | 1.57 mm | 0.8 mm | 0.031 in | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | Dual | |
Samtec Inc. | Gold | Female | Surface Mount | Non Specified - Dual Edge | Cantilever | 140 | Beryllium Copper | Black | 2 | 70 | Board Guide | 0.062 in | 1.57 mm | 0.8 mm | 0.031 in | Liquid Crystal Polymer (LCP) | 30 Áin | 0.76 Ám | -55 °C | 125 °C | Solder | Dual |
Samtec Inc. | Gold | Female | Surface Mount | Non Specified - Dual Edge | Cantilever | 140 | Beryllium Copper | Black | 2 | 70 | 0.062 in | 1.57 mm | 0.8 mm | 0.031 in | Liquid Crystal Polymer (LCP) | 30 Áin | 0.76 Ám | -55 °C | 125 °C | Solder | Dual | |
Samtec Inc. | Gold | Female | Surface Mount | Non Specified - Dual Edge | Cantilever | 140 | Beryllium Copper | Black | 2 | 70 | Board Guide | 0.093 in | 2.36 mm | 0.8 mm | 0.031 in | Liquid Crystal Polymer (LCP) | 30 Áin | 0.76 Ám | -55 °C | 125 °C | Solder | Dual |
Samtec Inc. | Gold | Female | Surface Mount | Non Specified - Dual Edge | Cantilever | 140 | Beryllium Copper | Black | 2 | 70 | Board Guide Board Lock | 0.062 in | 1.57 mm | 0.8 mm | 0.031 in | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | Dual |
Samtec Inc. | Gold | Female | Surface Mount | Non Specified - Dual Edge | Cantilever | 140 | Beryllium Copper | Black | 2 | 70 | Board Guide | 0.062 in | 1.57 mm | 0.8 mm | 0.031 in | Liquid Crystal Polymer (LCP) | 30 Áin | 0.76 Ám | -55 °C | 125 °C | Solder | Dual |
Samtec Inc. | Gold | Female | Surface Mount | Non Specified - Dual Edge | Cantilever | 140 | Beryllium Copper | Black | 2 | 70 | Board Guide | 0.062 in | 1.57 mm | 0.8 mm | 0.031 in | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | Dual |
Samtec Inc. | Gold | Female | Surface Mount | Non Specified - Dual Edge | Cantilever | 140 | Beryllium Copper | Black | 2 | 70 | Board Guide Solder Retention | 0.062 in | 1.57 mm | 0.8 mm | 0.031 in | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | Dual |