08-0503 Series

Catalog

CONN SOCKET SIP 8POS GOLD

Part	Pitch - Mating	Pitch - Mating	Type	Contact Finish - Post	Contact Material - Post [custom]	Contact Material - Mating	Number of Positions or Pins (Grid)	Termination Post Length [x]	Termination Post Length [x]	Contact Finish - Mating	Mounting Type	Pitch - Post	Pitch - Post	Current Rating (Amps)	Termination	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length
Aries Electronics 08-0503-21	0.1 in	2.54 mm	SIP	Gold	Brass	Beryllium Copper	8	0.36 in	9.14 mm	Gold	Through Hole	2.54 mm	0.1 in	3 A	Wire Wrap	UL94 HB	10 çin	0.25 çm	Polyamide (PA) Nylon Glass Filled	30 Áin	0.76 Ám
Aries Electronics 08-0503-31	0.1 in	2.54 mm	SIP	Gold	Brass	Beryllium Copper	8			Gold	Through Hole	2.54 mm	0.1 in	3 A	Wire Wrap	UL94 HB	10 çin	0.25 çm	Polyamide (PA) Nylon Glass Filled	30 Áin	0.76 Ám	0.5 in	12.7 mm
Aries Electronics 08-0503-30	0.1 in	2.54 mm	SIP	Tin	Brass	Beryllium Copper	8			Gold	Through Hole	2.54 mm	0.1 in	3 A	Wire Wrap	UL94 HB	200 µin	5.08 µm	Polyamide (PA) Nylon Glass Filled	30 Áin	0.76 Ám	0.5 in	12.7 mm