CONN HEADER SMD 92POS 0.8MM
| Part | Contact Finish - Post | Contact Material | Connector Type | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Insulation Height [z] | Insulation Height [z] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Shrouding | Termination | Number of Positions | Pitch - Mating | Pitch - Mating | Insulation Color | Contact Length - Mating [x] | Contact Length - Mating [x] | Mounting Type | Current Rating (Amps) | Number of Positions Loaded | Contact Type | Contact Shape | Material Flammability Rating | Operating Temperature [Min] | Operating Temperature [Max] | Row Spacing - Mating | Row Spacing - Mating | Number of Rows | Insulation Material | Fastening Type | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | Phosphor Bronze | Header | Gold | 10 çin | 0.25 çm | 0.055 in | 1.4 mm | 3 µin | 0.076 µm | Unshrouded | Solder | 92 | 0.031 in | 0.8 mm | Black | 1.9 mm | 0.075 in | Surface Mount | 2.7 A | All | Male Pin | Square | UL94 V-0 | -55 °C | 125 °C | 1.2 mm | 0.047 in | 2 | Liquid Crystal Polymer (LCP) | Push-Pull | |
Samtec Inc. | Gold | Phosphor Bronze | Header | Gold | 10 çin | 0.25 çm | 0.055 in | 1.4 mm | Unshrouded | Solder | 92 | 0.031 in | 0.8 mm | Black | 1.9 mm | 0.075 in | Surface Mount | 2.7 A | All | Male Pin | Square | UL94 V-0 | -55 °C | 125 °C | 1.2 mm | 0.047 in | 2 | Liquid Crystal Polymer (LCP) | Push-Pull | End Shrouds | ||
Samtec Inc. | Gold | Phosphor Bronze | Header | Gold | 10 çin | 0.25 çm | 0.055 in | 1.4 mm | Unshrouded | Solder | 92 | 0.031 in | 0.8 mm | Black | 1.9 mm | 0.075 in | Surface Mount | 2.7 A | All | Male Pin | Square | UL94 V-0 | -55 °C | 125 °C | 1.2 mm | 0.047 in | 2 | Liquid Crystal Polymer (LCP) | Push-Pull | Board Guide End Shrouds |