37-0518 Series

Catalog

CONN SOCKET SIP 37POS GOLD

Part	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Housing Material	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Finish - Mating	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Contact Material - Post [custom]	Mounting Type	Contact Material - Mating	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length [x]	Termination Post Length [x]	Current Rating (Amps)	Termination	Termination Post Length	Termination Post Length
Aries Electronics 37-0518-00	37	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Tin	Gold	SIP	200 µin	5.08 µm	UL94 V-0	Brass	Surface Mount	Beryllium Copper	Open Frame	10 çin	0.25 çm	0.046 in	1.17 mm	3 A	Solder
Aries Electronics 37-0518-10H	37	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Tin	Gold	SIP	200 µin	5.08 µm	UL94 V-0	Brass	Through Hole	Beryllium Copper	Open Frame	10 çin	0.25 çm			3 A	Solder	3.18 mm	0.125 in
Aries Electronics 37-0518-10T	37	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Tin	Gold	SIP	200 µin	5.08 µm	UL94 V-0	Brass	Through Hole	Beryllium Copper	Open Frame	10 çin	0.25 çm			3 A	Solder	3.18 mm	0.125 in
Aries Electronics 37-0518-11H	37	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Gold	Gold	SIP	10 çin	0.25 çm	UL94 V-0	Brass	Through Hole	Beryllium Copper	Open Frame	10 çin	0.25 çm			3 A	Solder	3.18 mm	0.125 in
Aries Electronics 37-0518-11	37	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Gold	Gold	SIP	10 çin	0.25 çm	UL94 V-0	Brass	Through Hole	Beryllium Copper	Open Frame	10 çin	0.25 çm			3 A	Solder	3.18 mm	0.125 in