IL-WX-24 Series
Manufacturer: JAE Electronics
CONN HEADER SMD R/A 24POS 0.8MM
| Part | Style | Connector Type | Operating Temperature (Min) | Operating Temperature (Max) | Pitch - Mating | Contact Finish - Mating | Mounting Type | Shrouding | Features | Number of Rows | Contact Type | Contact Material | Insulation Height | Contact Length - Mating | Fastening Type | Insulation Color | Termination | Contact Finish - Post | Number of Positions Loaded | Contact Shape | Insulation Material | Row Spacing - Mating | Number of Positions | Current Rating (Per Contact) | Current Rating | Mated Stacking Height | Material Flammability Rating | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
JAE Electronics | Board | Header | -40 °C | 85 °C | 0.031 in | Tin | Right Angle Surface Mount | Shrouded - 4 Wall | Solder Retention | 2 | Male Pin | Copper Alloy | 0.185 in | 0.071 in | Push-Pull | Black | Solder | Tin | All | Square | Glass Filled Polyphenylene Sulfide (PPS) | 0.059 in | 24 pos | 500 mA | ||||
JAE Electronics | Board | Header | -40 °C | 85 °C | 0.031 in | Tin | Right Angle Surface Mount | Shrouded - 4 Wall | Board Guide Solder Retention | 2 | Male Pin | Copper Alloy | 0.185 in | 0.071 in | Push-Pull | Black | Solder | Tin | All | Square | Glass Filled Polyphenylene Sulfide (PPS) | 0.059 in | 24 pos | 500 mA | ||||
JAE Electronics | Board | Receptacle | -40 °C | 85 °C | 0.031 in | Tin | Surface Mount | Solder Retention | 2 | Forked | Copper Alloy | 0.128 in | Push-Pull | Black | Solder | All | Square | Glass Filled Polyphenylene Sulfide (PPS) | 0.059 in | 24 pos | 0.5 A | 4.5 mm | UL94 V-0 | General Purpose | ||||
JAE Electronics | Board | Header | -40 °C | 85 °C | 0.031 in | Tin | Right Angle Surface Mount | Shrouded - 4 Wall | Solder Retention | 2 | Male Pin | Copper Alloy | 0.185 in | 0.071 in | Push-Pull | Black | Solder | Tin | All | Square | Glass Filled Polyphenylene Sulfide (PPS) | 0.059 in | 24 pos | 500 mA | ||||
JAE Electronics | Board | Receptacle | -40 °C | 85 °C | 0.031 in | Tin | Surface Mount | Solder Retention | 2 | Forked | Copper Alloy | 0.128 in | Push-Pull | Black | Solder | All | Square | Glass Filled Polyphenylene Sulfide (PPS) | 0.059 in | 24 pos | 0.5 A | 4.5 mm | UL94 V-0 | General Purpose | ||||
JAE Electronics | Board | Header | -40 °C | 85 °C | 0.031 in | Tin | Surface Mount | Shrouded - 4 Wall | Board Guide Solder Retention | 2 | Male Pin | Brass | 0.144 in | 0.071 in | Push-Pull | Black | Solder | Tin | All | Square | Polyphenylene Sulfide (PPS) | 0.059 in | 24 pos | 500 mA | ||||
JAE Electronics | Board | Receptacle | -40 °C | 85 °C | 0.031 in | Gold | Surface Mount | Board Guide Solder Retention | 2 | Forked | Copper Alloy | 0.128 in | Push-Pull | Black | Solder | All | Square | Glass Filled Polyphenylene Sulfide (PPS) | 0.059 in | 24 pos | 0.5 A | 4.5 mm | UL94 V-0 | General Purpose | ||||
JAE Electronics | Board | Receptacle | -40 °C | 85 °C | 0.031 in | Tin | Surface Mount | Board Guide Solder Retention | 2 | Forked | Copper Alloy | 0.128 in | Push-Pull | Black | Solder | All | Square | Glass Filled Polyphenylene Sulfide (PPS) | 0.059 in | 24 pos | 0.5 A | 4.5 mm | UL94 V-0 | General Purpose | ||||
JAE Electronics | Board | Header | -40 °C | 85 °C | 0.031 in | Tin | Right Angle Surface Mount | Shrouded - 4 Wall | Board Guide Solder Retention | 2 | Male Pin | Copper Alloy | 0.185 in | 0.071 in | Push-Pull | Black | Solder | Tin | All | Square | Glass Filled Polyphenylene Sulfide (PPS) | 0.059 in | 24 pos | 500 mA | ||||
JAE Electronics | Board | Header | -40 °C | 85 °C | 0.031 in | Tin | Right Angle Surface Mount | Shrouded - 4 Wall | Solder Retention | 2 | Male Pin | Copper Alloy | 0.185 in | 0.071 in | Push-Pull | Black | Solder | Tin | All | Square | Glass Filled Polyphenylene Sulfide (PPS) | 0.059 in | 24 pos | 500 mA |