20-823 Series

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Operating Temperature (Min)	Operating Temperature (Max)	Contact Material - Post	Pitch - Post	Contact Finish Thickness - Post	Termination	Mounting Type	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Housing Material	Contact Finish Thickness - Mating	Contact Finish - Mating	Row Spacing	Type	Contact Finish - Post	Contact Material - Mating	Pitch - Mating	Features
Aries Electronics 20-823-90C	0.14 in	UL94 V-0	3 A	-55 °C	105 °C	Brass	0.1 in	200 µin	Solder	Horizontal Right Angle Through Hole	2	10	20	Glass Filled Nylon 4/6 PA46 Polyamide	30 µin	Gold	0.3 in	0.3" (7.62mm) Row Spacing DIP	Tin	Beryllium Copper	0.1 in	Closed Frame
Aries Electronics 20-823-90	0.145 in	UL94 V-0	1.5 A			Phosphor Bronze	0.1 in	10 µin	Solder	Horizontal Right Angle Through Hole	2	10	20	Nylon 4/6 PA46 Polyamide	10 µin	Gold	0.3 in	0.3" (7.62mm) Row Spacing DIP	Gold	Phosphor Bronze	0.1 in	Closed Frame