CONN IC DIP SOCKET ZIF 36POS
| Part | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Mounting Type | Type | Type | Type | Features | Material Flammability Rating | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Material - Post | Contact Material - Mating | Termination | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | 36 | 1.27 µm | 50 µin | 1.27 µm | 50 µin | 1 A | Through Hole | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Closed Frame | UL94 V-0 | Nickel Boron | 0.1 in | 2.54 mm | Nickel Boron | Beryllium Nickel | Beryllium Nickel | Solder | Polyphenylene Sulfide (PPS) Glass Filled |
Aries Electronics | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | 36 | 0.25 çm | 10 çin | 0.25 çm | 10 çin | 1 A | Through Hole | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Closed Frame | UL94 V-0 | Gold | 0.1 in | 2.54 mm | Gold | Beryllium Copper | Beryllium Copper | Solder | Polyphenylene Sulfide (PPS) Glass Filled |
Aries Electronics | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | 36 | 5.08 µm | 200 µin | 5.08 µm | 200 µin | 1 A | Through Hole | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Closed Frame | UL94 V-0 | 0.1 in | 2.54 mm | Tin | Beryllium Copper | Beryllium Copper | Solder | Polyphenylene Sulfide (PPS) Glass Filled |