SFM-133 Series

Catalog

CONN RCPT 66POS 0.05 GOLD PCB

Part	Insulation Color	Insulation Material	Number of Positions Loaded	Contact Finish - Post	Number of Rows	Current Rating (Amps)	Insulation Height	Insulation Height	Mated Stacking Heights	Voltage Rating	Mounting Type	Contact Material	Fastening Type	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Row Spacing - Mating	Row Spacing - Mating	Connector Type	Contact Length - Post [x]	Contact Length - Post [x]	Termination	Pitch - Mating	Pitch - Mating	Contact Shape	Number of Positions	Contact Type	Contact Finish - Mating	Style	Contact Length - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. SFM-133-01-S-D	Black	Liquid Crystal Polymer (LCP)	All	Tin	2	3.2 A	4.57 mm	0.18 "	6.02 mm 6.17 mm 7.8 mm 7.95 mm 9.58 mm 9.73 mm 11.48 mm 11.63 mm	250 VAC	Through Hole	Beryllium Copper	Push-Pull	-55 °C	125 °C	30 Áin	0.76 Ám	UL94 V-0	0.05 in	1.27 mm	Receptacle	0.12 in	3.05 mm	Solder	0.05 in	1.27 mm	Square	66	Female Socket	Gold	Board to Board Cable
Samtec Inc. SFM-133-03-S-D	Black	Liquid Crystal Polymer (LCP)	All	Tin	2	3.2 A	4.57 mm	0.18 "	6.02 mm 6.17 mm 7.8 mm 7.95 mm 9.58 mm 9.73 mm 11.48 mm 11.63 mm	250 VAC	Through Hole	Beryllium Copper	Push-Pull	-55 °C	125 °C	30 Áin	0.76 Ám	UL94 V-0	0.05 in	1.27 mm	Receptacle	0.075 in		Solder	0.05 in	1.27 mm	Square	66	Female Socket	Gold	Board to Board Cable	1.91 mm
Samtec Inc. SFM-133-02-H-D-LC	Black	Liquid Crystal Polymer (LCP)	All	Gold	2	3.2 A	4.7 mm	0.185 in	6.15 mm 6.3 mm 7.92 mm 8.08 mm 9.7 mm 9.86 mm 11.61 mm 11.76 mm	250 VAC	Surface Mount	Beryllium Copper	Push-Pull	-55 °C	125 °C	30 Áin	0.76 Ám	UL94 V-0	0.05 in	1.27 mm	Receptacle			Solder	0.05 in	1.27 mm	Square	66	Female Socket	Gold	Board to Board Cable		3 µin	0.076 µm