
MEC1609 Series
Manufacturer: Microchip Technology
MIXED SIGNAL MOBILE EMBEDDED CONTROLLER WITH FLASH AND ARC CORE 144 LFBGA 10X10X1.4 TRAY ROHS COMPLIANT: YES
| Part | Interface | Package / Case | Mounting Type | Applications | Package Width | Package Name | Package Length | Program Memory Type | Program Memory Size (FLASH) | RAM Size Width | RAM Size Depth | Number of I/O | Core Processor | Voltage - Supply | Operating Temperature (Min) | Operating Temperature (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | ACPI BC-Link I2C/SMBus LPC PECI PS/2 SPI VLPC | 144-LFBGA | Surface Mount | I/O Controller | 10 mm | 144-LFBGA | 10 mm | FLASH | 192 kB | 8 bit | 16 K | 115 | ARC-625D | 3.3 V | -40 °C | 85 °C |
Microchip Technology | ACPI BC-Link I2C/SMBus LPC PECI PS/2 SPI VLPC | 144-TFBGA | Surface Mount | I/O Controller | 7 mm | 144-TFBGA | 7 mm | FLASH | 192 kB | 8 bit | 16 K | 115 | ARC-625D | 3.3 V | 0 °C | 70 °C |
Microchip Technology | ACPI BC-Link I2C/SMBus LPC PECI PS/2 SPI VLPC | 144-LFBGA | Surface Mount | I/O Controller | 10 mm | 144-LFBGA | 10 mm | FLASH | 192 kB | 8 bit | 16 K | 115 | ARC-625D | 3.3 V | 0 °C | 70 °C |