ESD-118 Series

Catalog

CONN SOCKET 36POS 0.1 GOLD PCB

Part	Connector Type	Style	Contact Type	Material Flammability Rating	Insulation Height	Pitch - Mating	Mounting Type	Number of Positions Loaded	Row Spacing - Mating	Contact Length - Post	Contact Finish - Mating	Contact Finish - Post	Contact Finish Thickness - Mating	Fastening Type	Operating Temperature (Max)	Operating Temperature (Min)	Number of Positions	Number of Rows	Insulation Color	Termination	Contact Material	Contact Shape	Insulation Material	Contact Finish Thickness - Post
Samtec Inc. ESD-118-T-03	Elevated Socket	Board	Female Socket	UL94 V-0	0.3 in	0.1 in	Through Hole	All	0.1 in	0.153 in	Gold	Tin	10 µin	Push-Pull	125 °C	-55 °C	36	2	Black	Solder	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESD-118-G-23	Elevated Socket	Board	Female Socket	UL94 V-0	0.3 in	0.1 in	Through Hole	All	0.1 in	0.115 in	Gold	Gold	10 µin	Push-Pull	125 °C	-55 °C	36	2	Black	Solder	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	10 µin
Samtec Inc. ESD-118-G-05	Elevated Socket	Board	Female Socket	UL94 V-0	0.5 in	0.1 in	Through Hole	All	0.1 in	0.165 in	Gold	Gold	10 µin	Push-Pull	125 °C	-55 °C	36	2	Black	Solder	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	10 µin
Samtec Inc. ESD-118-T-25	Elevated Socket	Board	Female Socket	UL94 V-0	0.5 in	0.1 in	Through Hole	All	0.1 in	0.165 in	Gold	Tin	10 µin	Push-Pull	125 °C	-55 °C	36	2	Black	Solder	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESD-118-T-23	Elevated Socket	Board	Female Socket	UL94 V-0	0.3 in	0.1 in	Through Hole	All	0.1 in	0.115 in	Gold	Tin	10 µin	Push-Pull	125 °C	-55 °C	36	2	Black	Solder	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESD-118-T-07	Elevated Socket	Board	Female Socket	UL94 V-0	0.4 in	0.1 in	Through Hole	All	0.1 in	0.265 in	Gold	Tin	10 µin	Push-Pull	125 °C	-55 °C	36	2	Black	Solder	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESD-118-G-04	Elevated Socket	Board	Female Socket	UL94 V-0	0.4 in	0.1 in	Through Hole	All	0.1 in	0.253 in	Gold	Gold	10 µin	Push-Pull	125 °C	-55 °C	36	2	Black	Solder	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	10 µin