Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Features | Pitch - Mating | Pitch - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Type | Termination | Contact Material - Mating | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Material - Post | Contact Finish - Post | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | 0.1 in | 2.54 mm | 125 °C | -65 ░C | Through Hole | 30 Áin | 0.76 Ám | UL94 V-0 | PGA ZIF (ZIP) | Solder | Beryllium Copper | Gold | 2.54 mm | 0.1 in | Beryllium Copper | Tin | 3.18 mm | 0.125 in | 1 A | 200 µin | 5.08 µm |