Beta
⌘K
CONN IC DIP SOCKET 14POS TIN
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Termination | Current Rating (Amps) | Material Flammability Rating | Number of Positions or Pins (Grid) | Contact Material - Post | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Type | Type | Type | Housing Material | Pitch - Post | Pitch - Post | Contact Finish - Post | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 105 ░C | -55 °C | 0.1 in | 2.54 mm | 3.56 mm | 0.14 in | Solder | 1 A | UL94 V-0 | 14 | Phosphor Bronze | Phosphor Bronze | 5.08 µm | 200 µin | Through Hole | 0.3 " | 7.62 mm | DIP | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | Tin | Closed Frame Elevated | 200 µin | 5.08 µm | ||
Aries Electronics | 105 ░C | -55 °C | 0.1 in | 2.54 mm | 3.56 mm | 0.14 in | Solder | 3 A | UL94 V-0 | 14 | Beryllium Copper | 0.76 Ám | 30 Áin | Through Hole | 0.3 " | 7.62 mm | DIP | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | Gold | Closed Frame Elevated | 10 çin | 0.25 çm | Brass | Gold |