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ICA Series

IC & Component Sockets ".100"" Screw Machine DIP Socket\/

Manufacturer: Samtec Inc.

Catalog

IC & Component Sockets ".100"" Screw Machine DIP Socket\/

Catalog

IC & Component Sockets ".100"" Screw Machine DIP Socket\/

Part	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Features	Material Flammability Rating	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Current Rating (Amps)	Contact Finish - Post	Contact Finish - Mating	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Resistance	Type	Type	Type	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Termination
Samtec Inc. ICA-628-KGT	0.1 in	2.54 mm	Brass	Open Frame	UL94 V-0	Beryllium Copper	10 çin	0.25 çm	-55 °C	125 °C	1 A	Tin	Gold	Through Hole	30 Áin	0.76 Ám	10 mOhm	DIP	0.6 in	15.24 mm	28	2.54 mm	0.1 in	Solder
Samtec Inc. ICA-422-STT	0.1 in	2.54 mm	Brass	Open Frame	UL94 V-0	Beryllium Copper			-55 °C	105 ░C	1 A	Tin		Through Hole			10 mOhm	DIP	0.4 in	10.16 mm	22	2.54 mm	0.1 in	Solder
Samtec Inc. ICA-320-ZSGG	0.1 in	2.54 mm	Brass	Open Frame	UL94 V-0	Beryllium Copper	30 µin	0.76 µm	-55 °C	125 °C	1 A	Gold	Gold	Through Hole	30 Áin	0.76 Ám	10 mOhm	DIP	0.3 "	7.62 mm	20	2.54 mm	0.1 in	Solder
Samtec Inc. ICA-314-WTT-3	0.1 in	2.54 mm	Brass	Open Frame	UL94 V-0	Beryllium Copper			-55 °C	105 ░C	1 A	Tin		Through Hole			10 mOhm	DIP	0.3 "	7.62 mm	14	2.54 mm	0.1 in	Solder
Samtec Inc. ICA-316-ZSGG-L	0.1 in	2.54 mm	Brass	Open Frame	UL94 V-0	Beryllium Copper	30 µin	0.76 µm	-55 °C	125 °C	1 A	Gold	Gold	Through Hole	30 Áin	0.76 Ám	10 mOhm	DIP	0.3 "	7.62 mm	16	2.54 mm	0.1 in	Solder
Samtec Inc. ICA-624-ZSTT-L	0.1 in	2.54 mm	Brass	Open Frame	UL94 V-0	Beryllium Copper			-55 °C	105 ░C	1 A	Tin		Through Hole			10 mOhm	DIP	0.6 in	15.24 mm	24	2.54 mm	0.1 in	Solder
Samtec Inc. ICA-422-AGT	0.1 in	2.54 mm	Brass	Open Frame	UL94 V-0	Beryllium Copper	10 çin	0.25 çm	-55 °C	125 °C	1 A	Tin	Gold	Through Hole	30 Áin	0.76 Ám	10 mOhm	DIP	0.4 in	10.16 mm	22	2.54 mm	0.1 in	Solder
Samtec Inc. ICA-308-AGG	0.1 in	2.54 mm	Brass	Open Frame	UL94 V-0	Beryllium Copper	30 µin	0.76 µm	-55 °C	125 °C	1 A	Gold	Gold	Through Hole	30 Áin	0.76 Ám	10 mOhm	DIP	0.3 "	7.62 mm	8	2.54 mm	0.1 in	Solder