CONN IC DIP SOCKET 10POS GOLD
| Part | Contact Material - Post | Type | Type | Type | Pitch - Post | Pitch - Post | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Current Rating (Amps) | Contact Finish - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Housing Material | Contact Material - Mating | Termination | Termination Post Length [x] | Termination Post Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Phosphor Bronze | 22.86 mm | DIP | 0.9 in | 2.54 mm | 0.1 in | Tin | 0.1 in | 2.54 mm | Closed Frame | 200 µin | 5.08 µm | Through Hole | 3 A | Gold | 2 x 5 | 10 | 105 ░C | -55 °C | 10 çin | 0.25 çm | UL94 V-0 | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | Wire Wrap | 0.36 in | 9.14 mm |
Aries Electronics | Phosphor Bronze | 22.86 mm | DIP | 0.9 in | 2.54 mm | 0.1 in | Gold | 0.1 in | 2.54 mm | Closed Frame | 10 çin | 0.25 çm | Through Hole | 3 A | Gold | 2 x 5 | 10 | 125 °C | -55 °C | 10 çin | 0.25 çm | UL94 V-0 | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | Wire Wrap | 0.36 in | 9.14 mm |