CONN RCPT 44POS 0.1 GOLD SMD
| Part | Current Rating (Amps) | Insulation Height | Insulation Height | Contact Shape | Contact Type | Fastening Type | Number of Positions | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material | Insulation Color | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Rows | Number of Positions Loaded | Pitch - Mating | Pitch - Mating | Voltage Rating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Features | Insulation Material | Connector Type | Contact Finish - Mating | Contact Finish - Post | Contact Length - Post [x] | Contact Length - Post [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 4.1 A | 3.66 mm | 0.144 in | Square | Female Socket | Push-Pull | 44 | Surface Mount | -55 °C | 125 °C | Beryllium Copper | Black | Solder | 3 µin | 0.076 µm | 2 | All | 0.1 in | 2.54 mm | 400 VAC | 2.54 mm | 0.1 in | Board Guide Pick and Place | Liquid Crystal Polymer (LCP) | Receptacle Bottom Entry | Gold | Tin | ||||
Samtec Inc. | 4.1 A | 3.66 mm | 0.144 in | Square | Female Socket | Push-Pull | 44 | Surface Mount | -55 °C | 125 °C | Beryllium Copper | Black | Solder | 10 çin | 0.25 çm | 2 | All | 0.1 in | 2.54 mm | 400 VAC | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | Receptacle Bottom Entry | Gold | Tin | |||||
Samtec Inc. | 4.1 A | 3.66 mm | 0.144 in | Square | Female Socket | Push-Pull | 44 | Surface Mount | -55 °C | 125 °C | Beryllium Copper | Black | Solder | 3 µin | 0.076 µm | 2 | All | 0.1 in | 2.54 mm | 400 VAC | 2.54 mm | 0.1 in | Board Guide | Liquid Crystal Polymer (LCP) | Receptacle | Gold | Tin | ||||
Samtec Inc. | 4.1 A | 3.5 mm | 0.138 in | Square | Female Socket | Push-Pull | 44 | Through Hole | -55 °C | 125 °C | Beryllium Copper | Black | Solder | 30 Áin | 0.76 Ám | 2 | All | 0.1 in | 2.54 mm | 400 VAC | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | Receptacle | Gold | Tin | 0.12 in | 3.05 mm | |||
Samtec Inc. | 4.1 A | 3.66 mm | 0.144 in | Square | Female Socket | Push-Pull | 44 | Surface Mount | -55 °C | 125 °C | Beryllium Copper | Black | Solder | 10 çin | 0.25 çm | 2 | All | 0.1 in | 2.54 mm | 400 VAC | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | Receptacle | Gold | Tin | |||||
Samtec Inc. | 4.1 A | 3.66 mm | 0.144 in | Square | Female Socket | Push-Pull | 44 | Surface Mount | -55 °C | 125 °C | Beryllium Copper | Black | Solder | 20 µin | 0.51 µm | 2 | All | 0.1 in | 2.54 mm | 400 VAC | 2.54 mm | 0.1 in | Board Guide Pick and Place | Liquid Crystal Polymer (LCP) | Receptacle | Gold | Gold | 3 µin | 0.076 µm | ||
Samtec Inc. | 4.1 A | 3.5 mm | 0.138 in | Square | Female Socket | Push-Pull | 44 | Through Hole | -55 °C | 125 °C | Beryllium Copper | Black | Solder | 10 çin | 0.25 çm | 2 | All | 0.1 in | 2.54 mm | 400 VAC | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | Receptacle | Gold | Gold | 0.12 in | 3.05 mm | 3 µin | 0.076 µm | |
Samtec Inc. | 4.1 A | 3.5 mm | 0.138 in | Square | Female Socket | Push-Pull | 44 | Through Hole | -55 °C | 125 °C | Beryllium Copper | Black | Solder | 3 µin | 0.076 µm | 2 | All | 0.1 in | 2.54 mm | 400 VAC | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | Receptacle | Gold | Tin | 0.12 in | 3.05 mm | |||
Samtec Inc. | 4.1 A | 3.66 mm | 0.144 in | Square | Female Socket | Push-Pull | 44 | Surface Mount | -55 °C | 125 °C | Beryllium Copper | Black | Solder | 20 µin | 0.51 µm | 2 | All | 0.1 in | 2.54 mm | 400 VAC | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | Receptacle | Gold | Gold | 3 µin | 0.076 µm | |||
Samtec Inc. | 4.1 A | 3.66 mm | 0.144 in | Square | Female Socket | Push-Pull | 44 | Surface Mount | -55 °C | 125 °C | Beryllium Copper | Black | Solder | 3 µin | 0.076 µm | 2 | All | 0.1 in | 2.54 mm | 400 VAC | 2.54 mm | 0.1 in | Board Guide Pick and Place | Liquid Crystal Polymer (LCP) | Receptacle Bottom Entry | Gold | Tin |