24-4518 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Termination Post Length	Current Rating	Material Flammability Rating	Contact Finish Thickness - Post	Contact Material - Post	Contact Finish - Post	Features	Housing Material	Contact Finish - Mating	Pitch - Mating	Pitch - Post	Row Spacing	Type	Contact Material - Mating	Termination	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Mounting Type	Contact Finish Thickness - Mating
Aries Electronics 24-4518-01	0.125 in	3 A	UL94 V-0	200 µin	Brass	Tin	Open Frame	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	0.1 in	0.1 in	0.4 in	0.4" (10.16mm) Row Spacing DIP	Beryllium Copper	Solder	2	24	12	Through Hole	10 µin
Aries Electronics 24-4518-10H	0.125 in	3 A	UL94 V-0	200 µin	Brass	Tin	Open Frame	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	0.1 in	0.1 in	0.4 in	0.4" (10.16mm) Row Spacing DIP	Beryllium Copper	Solder	2	24	12	Through Hole	10 µin
Aries Electronics 24-4518-10	0.125 in	3 A	UL94 V-0	200 µin	Brass	Tin	Open Frame	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	0.1 in	0.1 in	0.4 in	0.4" (10.16mm) Row Spacing DIP	Beryllium Copper	Solder	2	24	12	Through Hole	10 µin
Aries Electronics 24-4518-00	0.125 in	3 A	UL94 V-0	200 µin	Brass	Tin	Open Frame	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	0.1 in	0.1 in	0.4 in	0.4" (10.16mm) Row Spacing DIP	Beryllium Copper	Solder	2	24	12	Surface Mount	10 µin
Aries Electronics 24-4518-10M	0.125 in	3 A	UL94 V-0	200 µin	Brass	Tin	Open Frame	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	0.1 in	0.1 in	0.4 in	0.4" (10.16mm) Row Spacing DIP	Beryllium Copper	Solder	2	24	12	Through Hole	10 µin