24-4518 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Housing Material	Contact Finish - Post	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid)	Material Flammability Rating	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Termination	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features
Aries Electronics 24-4518-01	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	Through Hole	0.1 in	2.54 mm	Gold	24	UL94 V-0	Brass	2.54 mm	0.1 in	3.18 mm	0.125 in	0.4 in	10.16 mm	DIP	10 çin	0.25 çm	Beryllium Copper	Solder	3 A	200 µin	5.08 µm	Open Frame
Aries Electronics 24-4518-10H	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	Through Hole	0.1 in	2.54 mm	Gold	24	UL94 V-0	Brass	2.54 mm	0.1 in	3.18 mm	0.125 in	0.4 in	10.16 mm	DIP	10 çin	0.25 çm	Beryllium Copper	Solder	3 A	200 µin	5.08 µm	Open Frame
Aries Electronics 24-4518-10E	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	Through Hole	0.1 in	2.54 mm	Gold	24	UL94 V-0	Brass	2.54 mm	0.1 in	3.18 mm	0.125 in	0.4 in	10.16 mm	DIP	10 çin	0.25 çm	Beryllium Copper	Solder	3 A	200 µin	5.08 µm	Open Frame
Aries Electronics 24-4518-10	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	Through Hole	0.1 in	2.54 mm	Gold	24	UL94 V-0	Brass	2.54 mm	0.1 in	3.18 mm	0.125 in	0.4 in	10.16 mm	DIP	10 çin	0.25 çm	Beryllium Copper	Solder	3 A	200 µin	5.08 µm	Open Frame
Aries Electronics 24-4518-10M	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	Through Hole	0.1 in	2.54 mm	Gold	24	UL94 V-0	Brass	2.54 mm	0.1 in	3.18 mm	0.125 in	0.4 in	10.16 mm	DIP	10 çin	0.25 çm	Beryllium Copper	Solder	3 A	200 µin	5.08 µm	Open Frame
Aries Electronics 24-4518-11H	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Through Hole	0.1 in	2.54 mm	Gold	24	UL94 V-0	Brass	2.54 mm	0.1 in	3.18 mm	0.125 in	0.4 in	10.16 mm	DIP	10 çin	0.25 çm	Beryllium Copper	Solder	3 A	10 çin	0.25 çm	Open Frame