CONN RCPT 60POS 0.1 GOLD PCB
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions | Fastening Type | Number of Rows | Insulation Height [z] | Insulation Height [z] | Insulation Material | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Finish - Mating | Mounting Type | Contact Material | Contact Type | Connector Type | Insulation Color | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Post [x] | Contact Length - Post [x] | Pitch - Mating | Pitch - Mating | Contact Shape | Number of Positions Loaded | Contact Finish - Post | Insulation Height | Insulation Height | Contact Length - Post | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | -55 °C | 125 °C | 60 | Push-Pull | 2 | 0.095 in | 2.41 mm | Liquid Crystal Polymer (LCP) | 2.54 mm | 0.1 in | Gold | Through Hole | Beryllium Copper | Female Socket | Receptacle | Black | 30 Áin | 0.76 Ám | Solder | 10 çin | 0.25 çm | 2.41 mm | 0.095 in | 0.1 in | 2.54 mm | Circular | All | Gold | ||||
Samtec Inc. | -55 °C | 105 ░C | 60 | Push-Pull | 2 | Liquid Crystal Polymer (LCP) | 2.54 mm | 0.1 in | Through Hole | Beryllium Copper | Female Socket | Receptacle | Black | Solder | 0.1 in | 2.54 mm | Circular | All | Tin | 3.1 mm | 0.122 in | 0.108 in | 2.75 mm | |||||||||
Samtec Inc. | -55 °C | 125 °C | 60 | Push-Pull | 2 | Liquid Crystal Polymer (LCP) | 2.54 mm | 0.1 in | Gold | Through Hole | Beryllium Copper | Female Socket | Receptacle | Black | 30 Áin | 0.76 Ám | Solder | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Circular | All | Gold | 3.1 mm | 0.122 in | 0.108 in | 2.75 mm |