TMS-129 Series
Manufacturer: Samtec Inc.
.050" (1.27MM) MICRO HEADER
| Part | Contact Type | Termination | Fastening Type | Style | Mounting Type | Insulation Material | Number of Positions Loaded | Insulation Height | Contact Shape | Contact Finish - Post | Pitch - Mating | Material Flammability Rating | Operating Temperature (Max) | Operating Temperature (Min) | Contact Length - Post | Number of Positions | Contact Finish - Mating | Number of Rows | Current Rating (Per Contact) | Insulation Color | Connector Type | Contact Length - Mating | Shrouding | Contact Finish Thickness - Mating | Contact Material | Overall Contact Length | Row Spacing - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Male Pin | Solder | Push-Pull | Board | Right Angle Through Hole | Liquid Crystal Polymer (LCP) | All | 0.098 in | Square | Tin | 0.05 in | UL94 V-0 | 125 °C | -55 °C | 0.14 in | 29 | Gold | 1 | 5 A | Black | Header | 0.23 in | Unshrouded | 10 µin | Phosphor Bronze | |||
Samtec Inc. | Male Pin | Solder | Push-Pull | Board | Through Hole | Liquid Crystal Polymer (LCP) | All | 0.1 in | Square | Tin | 0.05 in | UL94 V-0 | 125 °C | -55 °C | 0.12 in | 58 | Gold | 2 | 5 A | Black | Header | 0.23 in | Unshrouded | 30 µin | Phosphor Bronze | 0.45 in | 0.1 in | |
Samtec Inc. | Male Pin | Solder | Push-Pull | Board | Right Angle Through Hole | Liquid Crystal Polymer (LCP) | Square | Gold | 0.05 in | UL94 V-0 | 125 °C | -55 °C | 29 | Gold | 1 | Black | Header | Unshrouded | Phosphor Bronze | |||||||||
Samtec Inc. | Male Pin | Solder | Push-Pull | Board | Through Hole | Liquid Crystal Polymer (LCP) | All | 0.1 in | Square | Tin | 0.05 in | UL94 V-0 | 125 °C | -55 °C | 0.12 in | 29 | Gold | 1 | 5 A | Black | Header | 0.285 in | Unshrouded | 30 µin | Phosphor Bronze | 0.505 in | ||
Samtec Inc. | Male Pin | Solder | Push-Pull | Board | Right Angle Through Hole | Liquid Crystal Polymer (LCP) | All | 0.197 in | Square | Tin | 0.05 in | UL94 V-0 | 125 °C | -55 °C | 0.14 in | 58 | Gold | 2 | 5 A | Black | Header | 0.1 in | Unshrouded | 10 µin | Phosphor Bronze | 0.1 in | ||
Samtec Inc. | Male Pin | Solder | Push-Pull | Board | Through Hole | Liquid Crystal Polymer (LCP) | All | 0.1 in | Square | Gold | 0.05 in | UL94 V-0 | 125 °C | -55 °C | 0.12 in | 29 | Gold | 1 | 5 A | Black | Header | 0.19 in | Unshrouded | 10 µin | Phosphor Bronze | 0.41 in | 3 µin | |
Samtec Inc. | ||||||||||||||||||||||||||||
Samtec Inc. | Male Pin | Solder | Push-Pull | Board | Right Angle Through Hole | Liquid Crystal Polymer (LCP) | All | 0.098 in | Square | Gold | 0.05 in | UL94 V-0 | 125 °C | -55 °C | 0.14 in | 29 | Gold | 1 | 5 A | Black | Header | 0.23 in | Unshrouded | 10 µin | Phosphor Bronze | 3 µin | ||
Samtec Inc. | Male Pin | Solder | Push-Pull | Board | Through Hole | Liquid Crystal Polymer (LCP) | All | 0.1 in | Square | Gold | 0.05 in | UL94 V-0 | 125 °C | -55 °C | 0.12 in | 58 | Gold | 2 | 5 A | Black | Header | 0.1 in | Unshrouded | 10 µin | Phosphor Bronze | 0.32 in | 0.1 in | 3 µin |
Samtec Inc. | Male Pin | Solder | Push-Pull | Board | Through Hole | Liquid Crystal Polymer (LCP) | All | 0.1 in | Square | Tin | 0.05 in | UL94 V-0 | 125 °C | -55 °C | 0.12 in | 58 | Gold | 2 | 5 A | Black | Header | 0.335 in | Unshrouded | 30 µin | Phosphor Bronze | 0.555 in | 0.1 in |