CONN IC DIP SOCKET ZIF 48POS TIN
| Part | Contact Material - Mating | Mounting Type | Material Flammability Rating | Housing Material | Current Rating (Amps) | Features | Type | Type | Type | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Material - Post | Termination | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-3574-10 | Beryllium Copper | Through Hole | UL94 V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | Closed Frame | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Tin | 48 | 200 µin | 5.08 µm | 5.08 µm | 200 µin | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Beryllium Copper | Solder | 0.11 in | 2.78 mm |
Aries Electronics 48-3574-11 | Beryllium Copper | Through Hole | UL94 V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | Closed Frame | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Tin | 48 | 200 µin | 5.08 µm | 5.08 µm | 200 µin | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Beryllium Copper | Solder | 0.11 in | 2.78 mm |
Aries Electronics 48-3574-18 | Beryllium Copper | Through Hole | UL94 V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | Closed Frame | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Tin | 48 | 200 µin | 5.08 µm | 5.08 µm | 200 µin | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Beryllium Copper | Solder | 0.11 in | 2.78 mm |
Aries Electronics 48-3574-16 | Beryllium Copper | Through Hole | UL94 V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | Closed Frame | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Tin | 48 | 200 µin | 5.08 µm | 5.08 µm | 200 µin | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Beryllium Copper | Solder | 0.11 in | 2.78 mm |