CONN RCPT 52POS 0.1 GOLD SMD
| Part | Contact Type | Connector Type | Number of Positions | Voltage Rating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Insulation Height | Insulation Height | Number of Positions Loaded | Pitch - Mating | Pitch - Mating | Number of Rows | Contact Material | Insulation Material | Contact Finish - Mating | Current Rating (Amps) | Contact Shape | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Mounting Type | Insulation Color | Fastening Type | Features | Contact Length - Post [x] | Contact Length - Post [x] | Contact Length - Post | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Female Socket | Receptacle | 52 | 400 VAC | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | Gold | -55 °C | 125 °C | 3.66 mm | 0.144 in | All | 0.1 in | 2.54 mm | 2 | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 4.1 A | Square | 0.51 µm | 20 µin | Solder | Surface Mount | Black | Push-Pull | |||||
Samtec Inc. | Female Socket | Receptacle | 52 | 400 VAC | 2.54 mm | 0.1 in | Tin | -55 °C | 125 °C | 3.66 mm | 0.144 in | All | 0.1 in | 2.54 mm | 2 | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 4.1 A | Square | 0.076 µm | 3 µin | Solder | Surface Mount | Black | Push-Pull | Board Guide | ||||||
Samtec Inc. | Female Socket | Receptacle Bottom Entry | 52 | 400 VAC | 2.54 mm | 0.1 in | Tin | -55 °C | 125 °C | 3.66 mm | 0.144 in | All | 0.1 in | 2.54 mm | 2 | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 4.1 A | Square | 0.076 µm | 3 µin | Solder | Surface Mount | Black | Push-Pull | Board Guide Pick and Place | ||||||
Samtec Inc. | Female Socket | Receptacle | 52 | 400 VAC | 2.54 mm | 0.1 in | Tin | -55 °C | 125 °C | 3.5 mm | 0.138 in | All | 0.1 in | 2.54 mm | 2 | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 4.1 A | Square | 0.076 µm | 3 µin | Solder | Through Hole | Black | Push-Pull | 0.12 in | 3.05 mm | |||||
Samtec Inc. | Female Socket | Receptacle Bottom Entry | 52 | 400 VAC | 2.54 mm | 0.1 in | Tin | -55 °C | 125 °C | 3.66 mm | 0.144 in | All | 0.1 in | 2.54 mm | 2 | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 4.1 A | Square | 0.076 µm | 3 µin | Solder | Surface Mount | Black | Push-Pull | |||||||
Samtec Inc. | Female Socket | Receptacle Bottom Entry | 52 | 400 VAC | 2.54 mm | 0.1 in | Tin | -55 °C | 125 °C | 3.66 mm | 0.144 in | All | 0.1 in | 2.54 mm | 2 | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 4.1 A | Square | 0.25 çm | 10 çin | Solder | Surface Mount | Black | Push-Pull | |||||||
Samtec Inc. | Female Socket | Receptacle Bottom Entry | 52 | 400 VAC | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | Gold | -55 °C | 125 °C | 3.66 mm | 0.144 in | All | 0.1 in | 2.54 mm | 2 | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 4.1 A | Square | 0.51 µm | 20 µin | Solder | Surface Mount | Black | Push-Pull | |||||
Samtec Inc. | Female Socket | 52 | 400 VAC | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | Gold | -55 °C | 125 °C | 3.5 mm | 0.138 in | All | 0.1 in | 2.54 mm | 2 | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 4.1 A | Square | 0.25 çm | 10 çin | Solder | Through Hole | Black | Push-Pull | 0.09 " | 2.29 mm | ||||
Samtec Inc. | Female Socket | Receptacle | 52 | 400 VAC | 2.54 mm | 0.1 in | Tin | -55 °C | 125 °C | 3.66 mm | 0.144 in | All | 0.1 in | 2.54 mm | 2 | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 4.1 A | Square | 0.25 çm | 10 çin | Solder | Surface Mount | Black | Push-Pull | Board Guide | ||||||
Samtec Inc. | Female Socket | Receptacle Bottom Entry | 52 | 400 VAC | 2.54 mm | 0.1 in | Tin | -55 °C | 125 °C | 3.66 mm | 0.144 in | All | 0.1 in | 2.54 mm | 2 | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 4.1 A | Square | 0.76 Ám | 30 Áin | Solder | Surface Mount | Black | Push-Pull |