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CONN IC DIP SOCKET 20POS GOLD
| Part | Features | Contact Material - Mating | Housing Material | Contact Finish - Post | Contact Material - Post [custom] | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Number of Positions or Pins (Grid) | Current Rating (Amps) | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Contact Finish - Mating | Termination | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | Tin | Brass | 3.56 mm | 0.14 in | 105 ░C | -55 °C | 20 | 3 A | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | DIP | 0.6 in | 15.24 mm | Gold | Solder | UL94 V-0 | 200 µin | 5.08 µm |