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CONN IC DIP SOCKET 8POS GOLD
| Part | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Finish - Post | Number of Positions or Pins (Grid) | Mounting Type | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Features | Pitch - Post | Pitch - Post | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | 30 Áin | 0.76 Ám | DIP | 0.6 in | 15.24 mm | 3.56 mm | 0.14 in | UL94 V-0 | Gold | 8 | Through Hole | 3 A | 0.1 in | 2.54 mm | Brass | Closed Frame Elevated | 2.54 mm | 0.1 in | 105 ░C | -55 °C | Beryllium Copper | Gold | 10 çin | 0.25 çm | Solder |