CONN HEADER SMD 56POS 1MM
| Part | Contact Material | Contact Type | Pitch - Mating | Pitch - Mating | Number of Rows | Current Rating (Amps) | Insulation Height | Insulation Height | Number of Positions | Contact Finish - Mating | Insulation Color | Contact Finish - Post | Termination | Row Spacing - Mating | Row Spacing - Mating | Mounting Type | Shrouding | Fastening Type | Insulation Material | Operating Temperature [Min] | Operating Temperature [Max] | Connector Type | Contact Length - Mating | Contact Length - Mating | Number of Positions Loaded | Features | Contact Shape | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Length - Mating [x] | Contact Length - Mating [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Phosphor Bronze | Male Pin | 0.039 in | 1 mm | 2 | 2.8 A per Contact | 0.038 in | 0.97 mm | 56 | Gold | Black | Tin | Solder | 0.039 " | 1 mm | Surface Mount | Unshrouded | Push-Pull | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Cuttable Header | 0.065 in | 1.65 mm | All | Pick and Place | Square | 3 µin | 0.076 µm | ||
Samtec Inc. | Phosphor Bronze | Male Pin | 0.039 in | 1 mm | 2 | 2.8 A per Contact | 0.038 in | 0.97 mm | 56 | Gold | Black | Tin | Solder | 0.039 " | 1 mm | Surface Mount | Unshrouded | Push-Pull | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Cuttable Header | All | Square | 10 çin | 0.25 çm | 1.9 mm | 0.075 in | |||
Samtec Inc. | Phosphor Bronze | Male Pin | 0.039 in | 1 mm | 2 | 2.8 A per Contact | 0.038 in | 0.97 mm | 56 | Gold | Black | Tin | Solder | 0.039 " | 1 mm | Surface Mount | Unshrouded | Push-Pull | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Cuttable Header | All | Pick and Place | Square | 10 çin | 0.25 çm | 1.9 mm | 0.075 in |