CEE0164 Series
Manufacturer: Amphenol ICC (FCI)
CONN PCI EXP FMALE 164POS 0.039
| Part | Pitch | Gender | Operating Temperature (Min) | Operating Temperature (Max) | Number of Positions | Read Out | Number of Rows | Card Thickness | Contact Finish Thickness | Contact Material | Contact Finish | Contact Type | Color | Features | Termination | Mounting Type | Card Type | Number of Bay | Material - Insulation |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | 0.039 in | Female | -55 °C | 105 °C | 11 164 | Dual | 2 | 0.062 in | 30 µin | Copper Alloy | Gold | Cantilever | Black | Board Guide Solder Retention | Solder | Surface Mount | PCI Express™ | 71 | Thermoplastic |
Amphenol ICC (FCI) | 0.039 in | Female | -55 °C | 105 °C | 11 164 | Dual | 2 | 0.062 in | 30 µin | Copper Alloy | Gold | Cantilever | Black | Board Guide Solder Retention | Solder | Surface Mount | PCI Express™ | 71 | Halogen Free Thermoplastic |
Amphenol ICC (FCI) | 0.039 in | Female | -55 °C | 105 °C | 11 164 | Dual | 2 | 0.062 in | 30 µin | Copper Alloy | Gold | Cantilever | Black | Board Guide Board Lock Pick and Place Solder Retention | Solder | Surface Mount | PCI Express™ | 71 | Thermoplastic |
Amphenol ICC (FCI) | 0.039 in | Female | -55 °C | 105 °C | 11 164 | Dual | 2 | 0.062 in | 30 µin | Copper Alloy | Gold | Cantilever | Black | Board Guide Solder Retention | Solder | Surface Mount | PCI Express™ | 71 | Halogen Free Thermoplastic |