48-6508 Series

Catalog

CONN IC DIP SOCKET 48POS GOLD

Part	Current Rating	Material Flammability Rating	Termination Post Length	Row Spacing	Type	Housing Material	Pitch - Post	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Features	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Termination	Pitch - Mating	Operating Temperature (Min)	Operating Temperature (Max)	Contact Material - Post	Contact Finish Thickness - Mating	Mounting Type	Contact Material - Mating
Aries Electronics 48-6508-20	3 A	UL94 V-0	0.36 in	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	200 µin	Tin	Gold	Open Frame	48	24	2	Wire Wrap	0.1 in	-55 °C	105 °C	Brass	30 µin	Through Hole	Beryllium Copper
Aries Electronics 48-6508-31	3 A	UL94 V-0	0.5 in	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	10 µin	Gold	Gold	Open Frame	48	24	2	Wire Wrap	0.1 in	-55 °C	125 °C	Brass	30 µin	Through Hole	Beryllium Copper
Aries Electronics 48-6508-30	3 A	UL94 V-0	0.5 in	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	200 µin	Tin	Gold	Open Frame	48	24	2	Wire Wrap	0.1 in	-55 °C	105 °C	Brass	30 µin	Through Hole	Beryllium Copper
Aries Electronics 48-6508-21	3 A	UL94 V-0	0.36 in	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	10 µin	Gold	Gold	Open Frame	48	24	2	Wire Wrap	0.1 in	-55 °C	125 °C	Brass	30 µin	Through Hole	Beryllium Copper