32-6556 Series

Catalog

32P DIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Material - Post [custom]	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Housing Material	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Mounting Type	Type	Type	Type	Current Rating (Amps)	Contact Finish - Post	Contact Material - Mating	Features	Termination
Aries Electronics 32-6556-41	2.54 mm	0.1 in	10 çin	0.25 çm	Gold	Brass	0.18 in	4.57 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	2 x 16	32	Through Hole	DIP	0.6 in	15.24 mm	3 A	Gold	Beryllium Copper	Open Frame
Aries Electronics 32-6556-31	2.54 mm	0.1 in	10 çin	0.25 çm	Gold	Brass	0.423 in	10.74 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	2 x 16	32	Through Hole	DIP	0.6 in	15.24 mm	3 A	Gold	Beryllium Copper	Open Frame	Wire Wrap
Aries Electronics 32-6556-10	2.54 mm	0.1 in	200 µin	5.08 µm	Gold	Brass	0.13 in	3.3 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	2 x 16	32	Through Hole	DIP	0.6 in	15.24 mm	3 A	Tin	Beryllium Copper	Open Frame	Solder
Aries Electronics 32-6556-40	2.54 mm	0.1 in	200 µin	5.08 µm	Gold	Brass	0.18 in	4.57 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	2 x 16	32	Through Hole	DIP	0.6 in	15.24 mm	3 A	Tin	Beryllium Copper	Open Frame