281-PRS Series
Manufacturer: Aries Electronics
CONN SOCKET PGA ZIF GOLD
| Part | Termination Post Length | Material Flammability Rating | Current Rating | Contact Finish Thickness - Post | Contact Finish - Mating | Features | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish Thickness - Mating | Pitch - Post | Type | Contact Material - Post | Mounting Type | Contact Material - Mating | Housing Material | Termination | Contact Finish - Post | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.125 in | UL94 V-0 | 1 A | 200 µin | Gold | Closed Frame | 125 °C | -65 °C | 30 µin | 0.1 in | PGA ZIF (ZIP) | Beryllium Copper | Through Hole | Beryllium Copper | Polyphenylene Sulfide PPS | Solder | Tin | 0.1 in |
Aries Electronics | 0.125 in | UL94 V-0 | 1 A | 200 µin | Gold | Closed Frame | 125 °C | -65 °C | 30 µin | 0.1 in | PGA ZIF (ZIP) | Beryllium Copper | Through Hole | Beryllium Copper | Polyphenylene Sulfide PPS | Solder | Tin | 0.1 in |
Aries Electronics | 0.125 in | UL94 V-0 | 1 A | 200 µin | Gold | Closed Frame | 125 °C | -65 °C | 30 µin | 0.1 in | PGA ZIF (ZIP) | Beryllium Copper | Through Hole | Beryllium Copper | Polyphenylene Sulfide PPS | Solder | Tin | 0.1 in |
Aries Electronics | 0.125 in | UL94 V-0 | 1 A | 200 µin | Gold | Closed Frame | 125 °C | -65 °C | 30 µin | 0.1 in | PGA ZIF (ZIP) | Beryllium Copper | Through Hole | Beryllium Copper | Polyphenylene Sulfide PPS | Solder | Tin | 0.1 in |