CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish - Mating | Current Rating (Amps) | Type | Termination | Pitch - Mating | Pitch - Mating | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Material Flammability Rating | Contact Material - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Features | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | 1 A | PGA ZIF (ZIP) | Solder | 0.1 in | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | Tin | UL94 V-0 | Beryllium Copper | 125 °C | -65 ░C | Closed Frame | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | Through Hole |
Aries Electronics | Gold | 1 A | PGA ZIF (ZIP) | Solder | 0.1 in | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | Tin | UL94 V-0 | Beryllium Copper | 125 °C | -65 ░C | Closed Frame | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | Through Hole |
Aries Electronics | Gold | 1 A | PGA ZIF (ZIP) | Solder | 0.1 in | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | Tin | UL94 V-0 | Beryllium Copper | 125 °C | -65 ░C | Closed Frame | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | Through Hole |