TMM-118 Series

Catalog

CONN UNSHROUDED HEADER HDR 36 POS 2MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Part	Contact Length - Post [x]	Contact Length - Post [x]	Shrouding	Contact Length - Mating	Contact Length - Mating	Contact Material	Insulation Height	Insulation Height	Style	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Color	Overall Contact Length	Overall Contact Length	Contact Type	Fastening Type	Current Rating (Amps)	Insulation Material	Number of Rows	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions	Contact Finish - Post	Mounting Type	Connector Type	Number of Positions Loaded	Row Spacing - Mating	Row Spacing - Mating	Contact Shape	Contact Finish - Mating	Termination	Pitch - Mating [x]	Pitch - Mating [x]	Material Flammability Rating	Features	Contact Length - Mating [x]	Contact Length - Mating [x]	Number of Positions Loaded	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post	Contact Length - Post
Samtec Inc. TMM-118-03-S-D	0.106 in	2.69 mm	Unshrouded	4 mm	0.157 in	Phosphor Bronze	1.5 mm	0.059 "	Board to Board Cable	30 Áin	0.76 Ám	Black	8.2 mm	0.323 in	Male Pin	Push-Pull	3.2 A	Liquid Crystal Polymer (LCP)	2	-55 °C	125 °C	36	Tin	Through Hole	Header	All	0.079 in	2 mm	Square	Gold	Solder	0.079 in	2 mm
Samtec Inc. TMM-118-01-L-S-SM-P			Unshrouded	3.2 mm	0.126 "	Phosphor Bronze	1.5 mm	0.059 "	Board to Board Cable	10 çin	0.25 çm	Black			Male Pin	Push-Pull	3.2 A	Liquid Crystal Polymer (LCP)	1	-55 °C	125 °C	18	Tin	Surface Mount	Header	All			Square	Gold	Solder	0.079 in	2 mm	UL94 V-0	Pick and Place
Samtec Inc. TMM-118-04-L-S-SM			Unshrouded			Phosphor Bronze	1.5 mm	0.059 "	Board to Board Cable	10 çin	0.25 çm	Black			Male Pin	Push-Pull	3.2 A	Liquid Crystal Polymer (LCP)	1	-55 °C	125 °C	18	Tin	Surface Mount	Header	All			Square	Gold	Solder	0.079 in	2 mm	UL94 V-0		1.9 mm	0.075 in
Samtec Inc. TMM-118-03-G-D-002	0.106 in	2.69 mm	Unshrouded	4 mm	0.157 in	Phosphor Bronze	1.5 mm	0.059 "	Board to Board Cable	20 µin	0.51 µm	Black	8.2 mm	0.323 in	Male Pin	Push-Pull	3.2 A	Liquid Crystal Polymer (LCP)	2	-55 °C	125 °C	36	Gold	Through Hole	Header		0.079 in	2 mm	Square	Gold	Solder	0.079 in	2 mm					35	3 µin	0.076 µm
Samtec Inc. TMM-118-01-L-D-SM-P-TR			Unshrouded	3.2 mm	0.126 "	Phosphor Bronze	1.5 mm	0.059 "	Board to Board Cable	10 çin	0.25 çm	Black			Male Pin	Push-Pull	3.2 A	Liquid Crystal Polymer (LCP)	2	-55 °C	125 °C	36	Tin	Surface Mount	Header	All	0.079 in	2 mm	Square	Gold	Solder	0.079 in	2 mm	UL94 V-0	Pick and Place
Samtec Inc. TMM-118-01-T-D-SM-P-TR			Unshrouded	3.2 mm	0.126 "	Phosphor Bronze	1.5 mm	0.059 "	Board to Board Cable			Black			Male Pin	Push-Pull	3.2 A	Liquid Crystal Polymer (LCP)	2	-55 °C	105 ░C	36	Tin	Surface Mount	Header	All	0.079 in	2 mm	Square		Solder	0.079 in	2 mm	UL94 V-0	Pick and Place
Samtec Inc. TMM-118-01-S-S-SM			Unshrouded	3.2 mm	0.126 "	Phosphor Bronze	1.5 mm	0.059 "	Board to Board Cable	30 Áin	0.76 Ám	Black			Male Pin	Push-Pull	3.2 A	Liquid Crystal Polymer (LCP)	1	-55 °C	125 °C	18	Tin	Surface Mount	Header	All			Square	Gold	Solder	0.079 in	2 mm	UL94 V-0
Samtec Inc. TMM-118-01-T-D			Unshrouded	3.2 mm	0.126 "	Phosphor Bronze	1.5 mm	0.059 "	Board to Board Cable			Black	8.2 mm	0.323 in	Male Pin	Push-Pull	3.2 A	Liquid Crystal Polymer (LCP)	2	-55 °C	105 ░C	36	Tin	Through Hole	Header	All	0.079 in	2 mm	Square		Solder	0.079 in	2 mm								3.5 mm	0.138 in
Samtec Inc. TMM-118-01-F-S			Unshrouded	3.2 mm	0.126 "	Phosphor Bronze	1.5 mm	0.059 "	Board to Board Cable	3 µin	0.076 µm	Black	8.2 mm	0.323 in	Male Pin	Push-Pull	3.2 A	Liquid Crystal Polymer (LCP)	1	-55 °C	125 °C	18	Tin	Through Hole	Header	All			Square	Gold	Solder	0.079 in	2 mm								3.5 mm	0.138 in
Samtec Inc. TMM-118-01-L-D-SM-A-036			Unshrouded	3.2 mm	0.126 "	Phosphor Bronze	1.5 mm	0.059 "	Board to Board Cable	10 çin	0.25 çm	Black			Male Pin	Push-Pull	3.2 A	Liquid Crystal Polymer (LCP)	2	-55 °C	125 °C	36	Tin	Surface Mount	Header		0.079 in	2 mm	Square	Gold	Solder	0.079 in	2 mm	UL94 V-0	Board Guide			35