TMM-118 Series

Catalog

CONN UNSHROUDED HEADER HDR 36 POS 2MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Part	Pitch - Mating	Number of Positions Loaded	Number of Rows	Mounting Type	Contact Material	Contact Finish Thickness - Mating	Contact Finish - Mating	Style	Contact Shape	Insulation Color	Contact Type	Fastening Type	Operating Temperature (Max)	Operating Temperature (Min)	Contact Length - Mating	Contact Finish - Post	Overall Contact Length	Insulation Material	Insulation Height	Current Rating (Per Contact)	Row Spacing - Mating	Connector Type	Number of Positions	Termination	Contact Length - Post	Shrouding	Features	Material Flammability Rating	Number of Positions Loaded	Contact Finish Thickness - Post
Samtec Inc. TMM-118-03-S-D	0.079 in	All	2	Through Hole	Phosphor Bronze	30 µin	Gold	Board Board or Cable	Square	Black	Male Pin	Push-Pull	125 °C	-55 °C	0.157 in	Tin	0.323 in	Liquid Crystal Polymer (LCP)	0.059 in	3.2 A	0.079 in	Header	36	Solder	0.106 in	Unshrouded
Samtec Inc. TMM-118-05-S-D-SM-A	0.079 in	All	2	Surface Mount	Phosphor Bronze	30 µin	Gold	Board Board or Cable	Square	Black	Male Pin	Push-Pull	125 °C	-55 °C	0.065 in	Tin		Liquid Crystal Polymer (LCP)	0.059 in	3.2 A	0.079 in	Header	36	Solder		Unshrouded	Board Guide	UL94 V-0
Samtec Inc. TMM-118-01-L-S-SM-P	0.079 in	All	1	Surface Mount	Phosphor Bronze	10 µin	Gold	Board Board or Cable	Square	Black	Male Pin	Push-Pull	125 °C	-55 °C	0.126 in	Tin		Liquid Crystal Polymer (LCP)	0.059 in	3.2 A		Header	18	Solder		Unshrouded	Pick and Place	UL94 V-0
Samtec Inc. TMM-118-03-G-D-002	0.079 in		2	Through Hole	Phosphor Bronze	20 Ąin	Gold	Board Board or Cable	Square	Black	Male Pin	Push-Pull	125 °C	-55 °C	0.157 in	Gold	0.323 in	Liquid Crystal Polymer (LCP)	0.059 in	3.2 A	0.079 in	Header	36	Solder	0.106 in	Unshrouded			35	3 µin
Samtec Inc. TMM-118-01-L-D-SM-P-TR	0.079 in	All	2	Surface Mount	Phosphor Bronze	10 µin	Gold	Board Board or Cable	Square	Black	Male Pin	Push-Pull	125 °C	-55 °C	0.126 in	Tin		Liquid Crystal Polymer (LCP)	0.059 in	3.2 A	0.079 in	Header	36	Solder		Unshrouded	Pick and Place	UL94 V-0
Samtec Inc. TMM-118-01-T-D-SM-P-TR	0.079 in	All	2	Surface Mount	Phosphor Bronze		Tin	Board Board or Cable	Square	Black	Male Pin	Push-Pull	105 °C	-55 °C	0.126 in	Tin		Liquid Crystal Polymer (LCP)	0.059 in	3.2 A	0.079 in	Header	36	Solder		Unshrouded	Pick and Place	UL94 V-0
Samtec Inc. TMM-118-01-L-D-SM	0.079 in	All	2	Surface Mount	Phosphor Bronze	10 µin	Gold	Board Board or Cable	Square	Black	Male Pin	Push-Pull	125 °C	-55 °C	0.126 in	Tin		Liquid Crystal Polymer (LCP)	0.059 in	3.2 A	0.079 in	Header	36	Solder		Unshrouded		UL94 V-0
Samtec Inc. TMM-118-01-S-S-SM	0.079 in	All	1	Surface Mount	Phosphor Bronze	30 µin	Gold	Board Board or Cable	Square	Black	Male Pin	Push-Pull	125 °C	-55 °C	0.126 in	Tin		Liquid Crystal Polymer (LCP)	0.059 in	3.2 A		Header	18	Solder		Unshrouded		UL94 V-0
Samtec Inc. TMM-118-03-G-D	0.079 in	All	2	Through Hole	Phosphor Bronze	20 Ąin	Gold	Board Board or Cable	Square	Black	Male Pin	Push-Pull	125 °C	-55 °C	0.157 in	Gold	0.323 in	Liquid Crystal Polymer (LCP)	0.059 in	3.2 A	0.079 in	Header	36	Solder	0.106 in	Unshrouded				3 µin
Samtec Inc. TMM-118-01-T-D	0.079 in	All	2	Through Hole	Phosphor Bronze		Tin	Board Board or Cable	Square	Black	Male Pin	Push-Pull	105 °C	-55 °C	0.126 in	Tin	0.323 in	Liquid Crystal Polymer (LCP)	0.059 in	3.2 A	0.079 in	Header	36	Solder	0.138 in	Unshrouded