16-3503 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Current Rating | Housing Material | Contact Finish Thickness - Post | Pitch - Post | Row Spacing | Type | Mounting Type | Termination | Contact Finish - Mating | Operating Temperature (Min) | Operating Temperature (Max) | Contact Material - Post | Contact Material - Mating | Pitch - Mating | Contact Finish - Post | Grid Rows | Number of Positions or Pins (Grid) | Grid Columns | Contact Finish Thickness - Mating | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.36 in | 3 A | Glass Filled Nylon 4/6 PA46 Polyamide | 200 µin | 0.1 in | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Wire Wrap | Gold | -55 °C | 105 °C | Phosphor Bronze | Beryllium Copper | 0.1 in | Tin | 2 | 16 | 8 | 10 µin | Closed Frame |
Aries Electronics | UL94 V-0 | 0.5 in | 3 A | Glass Filled Nylon 4/6 PA46 Polyamide | 10 µin | 0.1 in | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Wire Wrap | Gold | -55 °C | 125 °C | Phosphor Bronze | Beryllium Copper | 0.1 in | Gold | 2 | 16 | 8 | 10 µin | Closed Frame |
Aries Electronics | UL94 V-0 | 0.36 in | 3 A | Glass Filled Nylon 4/6 PA46 Polyamide | 10 µin | 0.1 in | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Wire Wrap | Gold | -55 °C | 125 °C | Phosphor Bronze | Beryllium Copper | 0.1 in | Gold | 2 | 16 | 8 | 10 µin | Closed Frame |