CONN IC DIP SOCKET 10POS GOLD
| Part | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Contact Material - Post | Housing Material | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Contact Finish - Post | Mounting Type | Termination | Features | Contact Material - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Type | Type | Type | Termination Post Length [x] | Termination Post Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2 x 5 | 10 | UL94 V-0 | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Phosphor Bronze | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 0.5 in | 12.7 mm | Gold | Through Hole | Wire Wrap | Closed Frame | Beryllium Copper | -55 °C | 125 °C | Gold | 10 çin | 0.25 çm | 3 A | 0.3 " | 7.62 mm | DIP | ||
Aries Electronics | 2 x 5 | 10 | UL94 V-0 | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Phosphor Bronze | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | Gold | Through Hole | Wire Wrap | Closed Frame | Beryllium Copper | -55 °C | 125 °C | Gold | 10 çin | 0.25 çm | 3 A | 0.3 " | 7.62 mm | DIP | 0.36 in | 9.14 mm | ||
Aries Electronics | 2 x 5 | 10 | UL94 V-0 | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Phosphor Bronze | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | Tin | Through Hole | Wire Wrap | Closed Frame | Beryllium Copper | -55 °C | 105 ░C | Gold | 10 çin | 0.25 çm | 3 A | 0.3 " | 7.62 mm | DIP | 0.36 in | 9.14 mm |