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CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Contact Material - Mating | Number of Positions or Pins (Grid) | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Type | Type | Type | Housing Material | Termination | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | 48 | Through Hole | 10 çin | 0.25 çm | 1 A | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Gold | 10 çin | 0.25 çm | Closed Frame | Gold | 0.1 in | 2.54 mm | UL94 V-0 | Beryllium Copper |