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CONN SOCKET PGA ZIF GOLD
| Part | Termination | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Finish - Post | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Current Rating (Amps) | Pitch - Post | Pitch - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Solder | PGA ZIF (ZIP) | 200 µin | 5.08 µm | Closed Frame | Beryllium Copper | 30 Áin | 0.76 Ám | Through Hole | Tin | 3.18 mm | 0.125 in | 125 °C | -65 ░C | Beryllium Copper | 0.1 in | 2.54 mm | UL94 V-0 | 1 A | 2.54 mm | 0.1 in | Gold |