28-6556 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Number of Positions or Pins (Grid)	Termination Post Length	Termination Post Length	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Mounting Type	Features	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Material - Mating	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Material Flammability Rating	Contact Finish - Mating	Termination
Aries Electronics 28-6556-10	28	3.3 mm	0.13 in	3 A	0.1 in	2.54 mm	Brass	Through Hole	Open Frame	DIP	0.6 in	15.24 mm	30 Áin	0.76 Ám	2.54 mm	0.1 in	Beryllium Copper	Tin	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	Gold	Solder
Aries Electronics 28-6556-30	28	10.74 mm	0.423 in	3 A	0.1 in	2.54 mm	Brass	Through Hole	Open Frame	DIP	0.6 in	15.24 mm	30 Áin	0.76 Ám	2.54 mm	0.1 in	Beryllium Copper	Tin	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	Gold	Wire Wrap
Aries Electronics 28-6556-40	28	4.57 mm	0.18 in	3 A	0.1 in	2.54 mm	Brass	Through Hole	Open Frame	DIP	0.6 in	15.24 mm	30 Áin	0.76 Ám	2.54 mm	0.1 in	Beryllium Copper	Tin	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	Gold
Aries Electronics 28-6556-31	28	10.74 mm	0.423 in	3 A	0.1 in	2.54 mm	Brass	Through Hole	Open Frame	DIP	0.6 in	15.24 mm	30 Áin	0.76 Ám	2.54 mm	0.1 in	Beryllium Copper	Gold	10 çin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	Gold	Wire Wrap
Aries Electronics 28-6556-11	28	3.3 mm	0.13 in	3 A	0.1 in	2.54 mm	Brass	Through Hole	Open Frame	DIP	0.6 in	15.24 mm	30 Áin	0.76 Ám	2.54 mm	0.1 in	Beryllium Copper	Gold	10 çin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	Gold	Solder
Aries Electronics 28-6556-41	28	4.57 mm	0.18 in	3 A	0.1 in	2.54 mm	Brass	Through Hole	Open Frame	DIP	0.6 in	15.24 mm	30 Áin	0.76 Ám	2.54 mm	0.1 in	Beryllium Copper	Gold	10 çin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	Gold