28-6556 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Current Rating	Material Flammability Rating	Termination Post Length	Pitch - Post	Termination	Features	Contact Material - Post	Contact Finish - Mating	Contact Material - Mating	Contact Finish - Post	Housing Material	Row Spacing	Type	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Finish Thickness - Post	Pitch - Mating	Mounting Type	Contact Finish Thickness - Mating
Aries Electronics 28-6556-10	3 A	UL94 V-0	0.13 in	0.1 in	Solder	Open Frame	Brass	Gold	Beryllium Copper	Tin	Glass Filled Polyphenylene Sulfide PPS	0.6 in	0.6" (15.24mm) Row Spacing DIP	14	28	2	200 µin	0.1 in	Through Hole	30 µin
Aries Electronics 28-6556-30	3 A	UL94 V-0	0.423 in	0.1 in	Wire Wrap	Open Frame	Brass	Gold	Beryllium Copper	Tin	Glass Filled Polyphenylene Sulfide PPS	0.6 in	0.6" (15.24mm) Row Spacing DIP	14	28	2	200 µin	0.1 in	Through Hole	30 µin
Aries Electronics 28-6556-40	3 A	UL94 V-0	0.18 in	0.1 in	Solder Cup	Open Frame	Brass	Gold	Beryllium Copper	Tin	Glass Filled Polyphenylene Sulfide PPS	0.6 in	0.6" (15.24mm) Row Spacing DIP	14	28	2	200 µin	0.1 in	Through Hole	30 µin
Aries Electronics 28-6556-31	3 A	UL94 V-0	0.423 in	0.1 in	Wire Wrap	Open Frame	Brass	Gold	Beryllium Copper	Gold	Glass Filled Polyphenylene Sulfide PPS	0.6 in	0.6" (15.24mm) Row Spacing DIP	14	28	2	10 µin	0.1 in	Through Hole	30 µin
Aries Electronics 28-6556-11	3 A	UL94 V-0	0.13 in	0.1 in	Solder	Open Frame	Brass	Gold	Beryllium Copper	Gold	Glass Filled Polyphenylene Sulfide PPS	0.6 in	0.6" (15.24mm) Row Spacing DIP	14	28	2	10 µin	0.1 in	Through Hole	30 µin
Aries Electronics 28-6556-41	3 A	UL94 V-0	0.18 in	0.1 in	Solder Cup	Open Frame	Brass	Gold	Beryllium Copper	Gold	Glass Filled Polyphenylene Sulfide PPS	0.6 in	0.6" (15.24mm) Row Spacing DIP	14	28	2	10 µin	0.1 in	Through Hole	30 µin
Aries Electronics 28-6556-21	3 A	UL94 V-0	0.283 in	0.1 in	Wire Wrap	Open Frame	Brass	Gold	Beryllium Copper	Gold	Glass Filled Polyphenylene Sulfide PPS	0.6 in	0.6" (15.24mm) Row Spacing DIP	14	28	2	10 µin	0.1 in	Through Hole	30 µin