CONN HEADER SMD 47POS 2MM
| Part | Fastening Type | Operating Temperature [Min] | Operating Temperature [Max] | Insulation Material | Contact Shape | Insulation Height | Insulation Height | Contact Type | Current Rating (Amps) | Contact Finish - Post | Number of Rows | Insulation Color | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Shrouding | Pitch - Mating [x] | Pitch - Mating [x] | Contact Length - Mating | Contact Length - Mating | Connector Type | Material Flammability Rating | Contact Material | Style | Mounting Type | Termination | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions Loaded | Contact Length - Post [x] | Contact Length - Post [x] | Row Spacing - Mating | Row Spacing - Mating | Number of Positions | Overall Contact Length | Overall Contact Length | Contact Length - Post | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Push-Pull | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Square | 1.5 mm | 0.059 " | Male Pin | 3.2 A | Gold | 1 | Black | 0.51 µm | 20 µin | Unshrouded | 0.079 in | 2 mm | 3.2 mm | 0.126 " | Header | UL94 V-0 | Phosphor Bronze | Board to Board Cable | Surface Mount | Solder | Gold | 3 µin | 0.076 µm | All | |||||||||
Samtec Inc. | Push-Pull | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Square | 2 mm | 0.079 in | Male Pin | 3.2 A | Tin | 1 | Black | 0.076 µm | 3 µin | Unshrouded | 0.079 in | 2 mm | 3.2 mm | 0.126 " | Header | Phosphor Bronze | Board to Board Cable | Through Hole Right Angle | Solder | Gold | All | 0.12 in | 3.05 mm | ||||||||||
Samtec Inc. | Push-Pull | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Square | 3.94 mm | 0.155 in | Male Pin | 3.2 A | Gold | 2 | Black | 0.51 µm | 20 µin | Unshrouded | 0.079 in | 2 mm | 3.2 mm | 0.126 " | Header | Phosphor Bronze | Board to Board Cable | Through Hole Right Angle | Solder | Gold | 3 µin | 0.076 µm | All | 0.12 in | 3.05 mm | 0.079 in | 2 mm | 94 | |||||
Samtec Inc. | Push-Pull | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Square | 1.5 mm | 0.059 " | Male Pin | 3.2 A | Tin | 1 | Black | 0.76 Ám | 30 Áin | Unshrouded | 0.079 in | 2 mm | 3.2 mm | 0.126 " | Header | Phosphor Bronze | Board to Board Cable | Through Hole | Solder | Gold | All | 8.2 mm | 0.323 in | 3.5 mm | 0.138 in | ||||||||
Samtec Inc. | Push-Pull | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Square | 1.5 mm | 0.059 " | Male Pin | 3.2 A | Gold | 1 | Black | 0.51 µm | 20 µin | Unshrouded | 0.079 in | 2 mm | 3.2 mm | 0.126 " | Header | Phosphor Bronze | Board to Board Cable | Through Hole | Solder | Gold | 3 µin | 0.076 µm | All | 8.2 mm | 0.323 in | 3.5 mm | 0.138 in | ||||||
Samtec Inc. | Push-Pull | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Square | 1.5 mm | 0.059 " | Male Pin | 3.2 A | Tin | 1 | Black | 0.76 Ám | 30 Áin | Unshrouded | 0.079 in | 2 mm | 3.2 mm | 0.126 " | Header | UL94 V-0 | Phosphor Bronze | Board to Board Cable | Surface Mount | Solder | Gold | All | |||||||||||
Samtec Inc. | Push-Pull | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Square | 1.5 mm | 0.059 " | Male Pin | 3.2 A | Gold | 2 | Black | 0.51 µm | 20 µin | Unshrouded | 0.079 in | 2 mm | 3.2 mm | 0.126 " | Header | Phosphor Bronze | Board to Board Cable | Through Hole | Solder | Gold | 3 µin | 0.076 µm | All | 0.079 in | 2 mm | 94 | 8.2 mm | 0.323 in | 3.5 mm | 0.138 in |