TMM-147 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 47POS 2MM
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish - Post | Style | Contact Length - Mating | Shrouding | Current Rating (Per Contact) | Insulation Color | Contact Shape | Number of Positions | Material Flammability Rating | Insulation Height | Contact Finish Thickness - Mating | Mounting Type | Contact Material | Fastening Type | Connector Type | Number of Rows | Number of Positions Loaded | Contact Finish - Mating | Insulation Material | Termination | Pitch - Mating | Contact Type | Contact Finish Thickness - Post | Contact Length - Post | Row Spacing - Mating | Overall Contact Length | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 125 °C | -55 °C | Gold | Board Board or Cable | 0.126 in | Unshrouded | 3.2 A | Black | Square | 47 | UL94 V-0 | 0.059 in | 20 Ąin | Surface Mount | Phosphor Bronze | Push-Pull | Header | 1 | All | Gold | Liquid Crystal Polymer (LCP) | Solder | 0.079 in | Male Pin | 3 µin | ||||
Samtec Inc. | 125 °C | -55 °C | Tin | Board Board or Cable | 0.126 in | Unshrouded | 3.2 A | Black | Square | 47 | 0.079 in | 3 µin | Right Angle Through Hole | Phosphor Bronze | Push-Pull | Header | 1 | All | Gold | Liquid Crystal Polymer (LCP) | Solder | 0.079 in | Male Pin | 0.12 in | |||||
Samtec Inc. | 125 °C | -55 °C | Gold | Board Board or Cable | 0.126 in | Unshrouded | 3.2 A | Black | Square | 94 | 0.155 in | 20 Ąin | Right Angle Through Hole | Phosphor Bronze | Push-Pull | Header | 2 | All | Gold | Liquid Crystal Polymer (LCP) | Solder | 0.079 in | Male Pin | 3 µin | 0.12 in | 0.079 in | |||
Samtec Inc. | 125 °C | -55 °C | Tin | Board Board or Cable | 0.126 in | Unshrouded | 3.2 A | Black | Square | 47 | 0.059 in | 30 µin | Through Hole | Phosphor Bronze | Push-Pull | Header | 1 | All | Gold | Liquid Crystal Polymer (LCP) | Solder | 0.079 in | Male Pin | 0.138 in | 0.323 in | ||||
Samtec Inc. | 125 °C | -55 °C | Gold | Board Board or Cable | 0.126 in | Unshrouded | 3.2 A | Black | Square | 47 | 0.059 in | 20 Ąin | Through Hole | Phosphor Bronze | Push-Pull | Header | 1 | All | Gold | Liquid Crystal Polymer (LCP) | Solder | 0.079 in | Male Pin | 3 µin | 0.138 in | 0.323 in | |||
Samtec Inc. | 125 °C | -55 °C | Tin | Board Board or Cable | 0.126 in | Unshrouded | 3.2 A | Black | Square | 47 | UL94 V-0 | 0.059 in | 30 µin | Surface Mount | Phosphor Bronze | Push-Pull | Header | 1 | All | Gold | Liquid Crystal Polymer (LCP) | Solder | 0.079 in | Male Pin | |||||
Samtec Inc. | 105 °C | -55 °C | Tin | Board Board or Cable | 0.126 in | Unshrouded | 3.2 A | Black | Square | 47 | 0.079 in | Right Angle Through Hole | Phosphor Bronze | Push-Pull | Header | 1 | Tin | Liquid Crystal Polymer (LCP) | Solder | 0.079 in | Male Pin | 0.12 in | 46 | ||||||
Samtec Inc. | 125 °C | -55 °C | Gold | Board Board or Cable | 0.126 in | Unshrouded | 3.2 A | Black | Square | 94 | 0.059 in | 20 Ąin | Through Hole | Phosphor Bronze | Push-Pull | Header | 2 | All | Gold | Liquid Crystal Polymer (LCP) | Solder | 0.079 in | Male Pin | 3 µin | 0.138 in | 0.079 in | 0.323 in |