ESS-105 Series
Manufacturer: Samtec Inc.
CONN SOCKET 5POS 0.1 GOLD PCB
| Part | Contact Finish - Mating | Fastening Type | Contact Length - Post | Contact Type | Material Flammability Rating | Style | Operating Temperature (Max) | Operating Temperature (Min) | Termination | Insulation Height | Number of Rows | Mounting Type | Insulation Color | Connector Type | Number of Positions Loaded | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Number of Positions | Contact Shape | Contact Material | Insulation Material | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | Push-Pull | 0.123 in | Female Socket | UL94 V-0 | Board | 125 °C | -55 °C | Solder | 0.4 in | 1 | Through Hole | Black | Elevated Socket | All | 0.1 in | Tin | 10 µin | 5 | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | |
Samtec Inc. | Gold | Push-Pull | 0.123 in | Female Socket | UL94 V-0 | Board | 125 °C | -55 °C | Solder | 0.4 in | 1 | Through Hole | Black | Elevated Socket | All | 0.1 in | Gold | 10 µin | 5 | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 µin |
Samtec Inc. | Gold | Push-Pull | 0.215 in | Female Socket | UL94 V-0 | Board | 125 °C | -55 °C | Solder | 0.3 in | 1 | Through Hole | Black | Elevated Socket | All | 0.1 in | Gold | 10 µin | 5 | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 µin |
Samtec Inc. | Tin | Push-Pull | 0.123 in | Female Socket | UL94 V-0 | Board | 125 °C | -55 °C | Solder | 0.4 in | 1 | Through Hole | Black | Elevated Socket | All | 0.1 in | Tin | 5 | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Tin | Push-Pull | 0.123 in | Female Socket | UL94 V-0 | Board | 125 °C | -55 °C | Solder | 0.4 in | 1 | Through Hole | Black | Elevated Socket | All | 0.1 in | Tin | 5 | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Gold | Push-Pull | 0.265 in | Female Socket | UL94 V-0 | Board | 125 °C | -55 °C | Solder | 0.4 in | 1 | Through Hole | Black | Elevated Socket | All | 0.1 in | Gold | 10 µin | 5 | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 µin |
Samtec Inc. | Gold | Push-Pull | 0.173 in | Female Socket | UL94 V-0 | Board | 125 °C | -55 °C | Press-Fit Solder | 0.5 in | 1 | Through Hole | Black | Elevated Socket | All | 0.1 in | Gold | 10 µin | 5 | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 µin |
Samtec Inc. | Gold | Push-Pull | 0.223 in | Female Socket | UL94 V-0 | Board | 125 °C | -55 °C | Solder | 0.3 in | 1 | Through Hole | Black | Elevated Socket | All | 0.1 in | Gold | 10 µin | 5 | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 µin |
Samtec Inc. | Tin | Push-Pull | 0.123 in | Female Socket | UL94 V-0 | Board | 125 °C | -55 °C | Solder | 0.3 in | 1 | Through Hole | Black | Elevated Socket | All | 0.1 in | Tin | 5 | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Gold | Push-Pull | 0.123 in | Female Socket | UL94 V-0 | Board | 125 °C | -55 °C | Solder | 0.3 in | 1 | Through Hole | Black | Elevated Socket | All | 0.1 in | Tin | 10 µin | 5 | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) |