BM23FR0.8 Series

Catalog

CONN HDR 10POS SMD GOLD

Part	Pitch	Number of Rows	Features	Number of Positions	Mounting Type	Contact Finish	Mated Stacking Height	Height Above Board	Connector Type	Contact Finish Thickness
Hirose Electric Co Ltd BM23FR0.8-10DP-0.35V(51)	0.014 in	2	Solder Retention	10	Surface Mount	Gold	0.8 mm	0.025 in	Header Outer Shroud Contacts	1.97 µin
Hirose Electric Co Ltd BM23FR0.8-18DP-0.35V(895)	0.014 in	2	Solder Retention	18	Surface Mount	Gold	0.8 mm	0.025 in	Header Outer Shroud Contacts	1.97 µin
Hirose Electric Co Ltd BM23FR0.8-10DS-0.35V(51)	0.014 in	2	Solder Retention	10	Surface Mount	Gold	0.8 mm	0.031 in	Center Strip Contacts Receptacle	1.97 µin
Hirose Electric Co Ltd BM23FR0.8-60DS-0.35V(895)	0.014 in	2	Solder Retention	60	Surface Mount	Gold	0.8 mm	0.031 in	Center Strip Contacts Receptacle	1.97 µin
Hirose Electric Co Ltd BM23FR0.8-10DS-0.35V(895)	0.014 in	2	Solder Retention	10	Surface Mount	Gold	0.8 mm	0.031 in	Center Strip Contacts Receptacle	1.97 µin
Hirose Electric Co Ltd BM23FR0.8-10DP-0.35V(895)	0.014 in	2	Solder Retention	10	Surface Mount	Gold	0.8 mm	0.025 in	Header Outer Shroud Contacts	1.97 µin
Hirose Electric Co Ltd BM23FR0.8-18DP-0.35V(51)	0.014 in	2	Solder Retention	18	Surface Mount	Gold	0.8 mm	0.025 in	Header Outer Shroud Contacts	1.97 µin
Hirose Electric Co Ltd BM23FR0.8-18DS-0.35V(895)	0.014 in	2	Solder Retention	18	Surface Mount	Gold	0.8 mm	0.031 in	Center Strip Contacts Receptacle	1.97 µin