CONN IC DIP SOCKET 24POS GOLD
| Part | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Finish - Mating | Number of Positions or Pins (Grid) | Contact Material - Post [custom] | Type | Type | Type | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Operating Temperature [Max] | Operating Temperature [Min] | Termination | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | Beryllium Copper | Gold | 24 | Brass | 0.3 " | 7.62 mm | DIP | 0.1 in | 2.54 mm | Tin | 105 ░C | -55 °C | Solder | 3 A | 3.56 mm | 0.14 in | 30 Áin | 0.76 Ám | Closed Frame | 200 µin | 5.08 µm | UL94 V-0 | Glass Filled Nylon 4/6 Polyamide (PA46) |