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CONN IC DIP SOCKET 8POS GOLD
| Part | Pitch - Mating | Pitch - Mating | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post [custom] | Mounting Type | Pitch - Post | Pitch - Post | Contact Resistance | Contact Finish - Mating | Termination | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) | Contact Finish - Post | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.1 in | 2.54 mm | Open Frame | 30 Áin | 0.76 Ám | Brass | Through Hole | 2.54 mm | 0.1 in | 10 mOhm | Gold | Solder | Beryllium Copper | 10 çin | 0.25 çm | 0.3 " | 7.62 mm | DIP | 3.18 mm | 0.125 in | 8 | Tin | 1 A | -55 °C | 125 °C | UL94 V-0 |