K32W061 Series
Manufacturer: NXP USA Inc.
HIGH PERFORMANCE AND ULTRA-LOW-POWER MCU FOR ZIGBEE ,THREAD, AND BLUETOOTH LE 5.0 WITH BUILT-IN NFC OPTION /REEL ROHS COMPLIANT:
| Part | Type | Mounting Type | Data Rate (Max) | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Serial Interfaces | Protocol | Current - Receiving | Package Length | Package Name | Package Width | RF Family/Standard | Operating Temperature (Max) | Operating Temperature (Min) | GPIO Count | Power - Output | Memory Type | Memory Size (Flash) | Memory Size (SRAM) | Current - Transmitting (Max) | Current - Transmitting (Min) | Package / Case | Sensitivity | Frequency |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | TxRx + MCU | Surface Mount | 2 MBaud | 1.9 V | 3.6 V | I2C PWM SPI UART | Bluetooth v5.0 | 4.3 mA | 6 mm | 40-HVQFN | 6 mm | 802.15.4 Bluetooth | 125 °C | -40 °C | 22 | 11.2 dBm | Flash SRAM | 640 kB | 152 kB | 20.3 mA | 7.4 mA | 40-VFQFN Exposed Pad | -101.3 dBm | 2.4 GHz |
NXP USA Inc. | TxRx + MCU | Surface Mount | 2 MBaud | 1.9 V | 3.6 V | I2C PWM SPI UART | Bluetooth v5.0 | 4.3 mA | 6 mm | 40-HVQFN | 6 mm | 802.15.4 Bluetooth | 125 °C | -40 °C | 22 | 11.2 dBm | Flash SRAM | 640 kB | 152 kB | 20.3 mA | 7.4 mA | 40-VFQFN Exposed Pad | -101.3 dBm | 2.4 GHz |
NXP USA Inc. | TxRx + MCU | Surface Mount | 2 MBaud | 1.9 V | 3.6 V | I2C PWM SPI UART | Bluetooth v5.0 | 4.3 mA | 6 mm | 40-HVQFN | 6 mm | 802.15.4 Bluetooth | 125 °C | -40 °C | 22 | 11.2 dBm | Flash SRAM | 640 kB | 152 kB | 20.3 mA | 7.4 mA | 40-VFQFN Exposed Pad | -101.3 dBm | 2.4 GHz |