HEATSINK FOR 45MM BGA
| Part | Power Dissipation @ Temperature Rise | Width [x] | Width [x] | Shape | Type | Material Finish | Attachment Method | Package Cooled | Material | Thermal Resistance @ Forced Air Flow | Length | Length | Fin Height [z] | Fin Height [z] | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette  | 4 W  | 43.18 mm  | 1.7 in  | Pin Fins  Square  | Top Mount  | Black Anodized  | Thermal Tape  Adhesive (Included)  | ASIC  BGA  CPU  LGA  | Aluminum  | 8 °C/W  300 LFM  | 44.45 mm  | 1.75 in  | 0.2 in  | 5.08 mm  | 
Wakefield-Vette  | 4 W  | 43.18 mm  | 1.7 in  | Pin Fins  Square  | Top Mount  | Black Anodized  | Thermal Tape  Adhesive (Included)  | ASIC  BGA  CPU  LGA  | Aluminum  | 8 °C/W  300 LFM  | 44.45 mm  | 1.75 in  | 0.2 in  | 5.08 mm  | 
Wakefield-Vette  | 4 W  | 43.18 mm  | 1.7 in  | Pin Fins  Square  | Top Mount  | Black Anodized  | Thermal Tape  Adhesive (Included)  | ASIC  BGA  CPU  LGA  | Aluminum  | 8 °C/W  300 LFM  | 44.45 mm  | 1.75 in  | 0.2 in  | 5.08 mm  | 
Wakefield-Vette  | 4 W  | 43.18 mm  | 1.7 in  | Pin Fins  Square  | Top Mount  | Black Anodized  | Thermal Tape  Adhesive (Included)  | ASIC  BGA  CPU  LGA  | Aluminum  | 8 °C/W  300 LFM  | 44.45 mm  | 1.75 in  | 0.2 in  | 5.08 mm  |