ESS-124 Series
Manufacturer: Samtec Inc.
CONN SOCKET 24POS 0.1 GOLD PCB
| Part | Number of Positions | Termination | Connector Type | Contact Length - Post | Mounting Type | Number of Positions Loaded | Pitch - Mating | Insulation Color | Fastening Type | Material Flammability Rating | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish - Post | Insulation Height | Contact Finish Thickness - Mating | Contact Type | Contact Finish - Mating | Number of Rows | Style | Insulation Material | Contact Shape | Contact Material | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 24 pos | Solder | Elevated Socket | 0.173 in | Through Hole | All | 0.1 in | Black | Push-Pull | UL94 V-0 | 125 °C | -55 °C | Tin | 0.5 in | 10 µin | Female Socket | Gold | 1 | Board | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | |
Samtec Inc. | 24 pos | Solder | Elevated Socket | 0.123 in | Through Hole | All | 0.1 in | Black | Push-Pull | UL94 V-0 | 125 °C | -55 °C | Tin | 0.4 in | 10 µin | Female Socket | Gold | 1 | Board | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | |
Samtec Inc. | 24 pos | Solder | Elevated Socket | 0.123 in | Through Hole | All | 0.1 in | Black | Push-Pull | UL94 V-0 | 125 °C | -55 °C | Tin | 0.4 in | Female Socket | Tin | 1 | Board | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | ||
Samtec Inc. | 24 pos | Solder | Elevated Socket | 0.123 in | Through Hole | All | 0.1 in | Black | Push-Pull | UL94 V-0 | 125 °C | -55 °C | Gold | 0.4 in | 10 µin | Female Socket | Gold | 1 | Board | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | 10 µin |
Samtec Inc. | 24 pos | Solder | Elevated Socket | 0.123 in | Through Hole | All | 0.1 in | Black | Push-Pull | UL94 V-0 | 125 °C | -55 °C | Tin | 0.3 in | 10 µin | Female Socket | Gold | 1 | Board | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | |
Samtec Inc. | 24 pos | Solder | Elevated Socket | 0.215 in | Through Hole | All | 0.1 in | Black | Push-Pull | UL94 V-0 | 125 °C | -55 °C | Gold | 0.3 in | 10 µin | Female Socket | Gold | 1 | Board | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | 10 µin |
Samtec Inc. | 24 pos | Solder | Elevated Socket | 0.173 in | Through Hole | All | 0.1 in | Black | Push-Pull | UL94 V-0 | 125 °C | -55 °C | Tin | 0.5 in | Female Socket | Tin | 1 | Board | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | ||
Samtec Inc. | 24 pos | Solder | Elevated Socket | 0.123 in | Through Hole | All | 0.1 in | Black | Push-Pull | UL94 V-0 | 125 °C | -55 °C | Gold | 0.3 in | 10 µin | Female Socket | Gold | 1 | Board | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | 10 µin |
Samtec Inc. | 24 pos | Solder | Elevated Socket | 0.123 in | Through Hole | All | 0.1 in | Black | Push-Pull | UL94 V-0 | 125 °C | -55 °C | Tin | 0.3 in | Female Socket | Tin | 1 | Board | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | ||
Samtec Inc. | 24 pos | Solder | Elevated Socket | 0.123 in | Through Hole | All | 0.1 in | Black | Push-Pull | UL94 V-0 | 125 °C | -55 °C | Tin | 0.4 in | 10 µin | Female Socket | Gold | 1 | Board | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper |