Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish - Post | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Operating Temperature [Max] | Operating Temperature [Min] | Termination Post Length | Termination Post Length | Material Flammability Rating | Termination | Pitch - Post | Pitch - Post | Contact Finish - Mating | Features | Type | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Tin | Beryllium Copper | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | Beryllium Copper | 200 µin | 5.08 µm | 1 A | 125 °C | -65 ░C | 3.18 mm | 0.125 in | UL94 V-0 | Solder | 2.54 mm | 0.1 in | Gold | Closed Frame | PGA ZIF (ZIP) | Through Hole |