Beta
⌘K
CONN IC DIP SOCKET 8POS GOLD
| Part | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Contact Finish - Post | Termination | Contact Finish - Mating | Material Flammability Rating | Termination Post Length | Termination Post Length | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Current Rating (Amps) | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.1 in | 2.54 mm | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | 200 µin | 5.08 µm | 2.54 mm | 0.1 in | 8 | Tin | Solder | Gold | UL94 V-0 | 3.56 mm | 0.14 in | Closed Frame | 30 Áin | 0.76 Ám | Brass | 105 ░C | -55 °C | 3 A | DIP | 0.6 in | 15.24 mm |