CONN SOCKET PGA ZIF GOLD
| Part | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Type | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Mounting Type | Contact Material - Post | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Current Rating (Amps) | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | 30 Áin | 0.76 Ám | UL94 V-0 | PGA ZIF (ZIP) | Tin | 200 µin | 5.08 µm | Solder | 125 °C | -65 ░C | Beryllium Copper | Through Hole | Beryllium Copper | 3.18 mm | 0.125 in | 0.1 in | 2.54 mm | Gold | 1 A | 2.54 mm | 0.1 in |
Aries Electronics | Closed Frame | 30 Áin | 0.76 Ám | UL94 V-0 | PGA ZIF (ZIP) | Tin | 200 µin | 5.08 µm | Solder | 125 °C | -65 ░C | Beryllium Copper | Through Hole | Beryllium Copper | 3.18 mm | 0.125 in | 0.1 in | 2.54 mm | Gold | 1 A | 2.54 mm | 0.1 in |