Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Pitch - Post | Pitch - Post | Contact Material - Post | Pitch - Mating | Pitch - Mating | Type | Contact Finish - Mating | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Features | Current Rating (Amps) | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Contact Finish - Post | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | Beryllium Copper | 0.1 in | 2.54 mm | PGA ZIF (ZIP) | Gold | Solder | 125 °C | -65 ░C | Closed Frame | 1 A | Beryllium Copper | 30 Áin | 0.76 Ám | UL94 V-0 | 200 µin | 5.08 µm | 3.18 mm | 0.125 in | Tin | Through Hole |