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CONN IC DIP SOCKET 10POS GOLD
| Part | Contact Material - Mating | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Housing Material | Features | Material Flammability Rating | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Post | Type | Type | Type | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Solder | 200 µin | 5.08 µm | 2.54 mm | 0.1 in | 3.56 mm | 0.14 in | 2 x 5 | 10 | 0.1 in | 2.54 mm | Gold | 30 Áin | 0.76 Ám | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Closed Frame | UL94 V-0 | 105 ░C | -55 °C | Tin | DIP | 5.08 mm | 0.2 in | Brass |