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CONN IC DIP SOCKET 38POS GOLD
| Part | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Type | Type | Type | Contact Material - Mating | Material Flammability Rating | Number of Positions or Pins (Grid) | Housing Material | Pitch - Post | Pitch - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | 200 µin | 5.08 µm | 3.56 mm | 0.14 in | Solder | 105 ░C | -55 °C | 0.1 in | 2.54 mm | Tin | DIP | 0.6 in | 15.24 mm | Beryllium Copper | UL94 V-0 | 38 | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | Closed Frame | 30 Áin | 0.76 Ám | 3 A | Brass |