W25X40 Series
Manufacturer: Winbond Electronics
IC FLASH 4MBIT SPI 100MHZ 8WSON
| Part | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Memory Format | Clock Frequency | Memory Size | Mounting Type | Memory Type | Package / Case | Memory Width | Memory Depth | Technology | Operating Temperature (Max) | Operating Temperature (Min) | Write Cycle Time - Word | Write Cycle Time - Page | Memory Interface (Type) | Package Length | Package Name | Package Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 100 MHz | 4 Mbit | Surface Mount | Non-Volatile | 8-WDFN Exposed Pad | 8 bit | 512 K | FLASH | 85 °C | -40 °C | 3 ms | 3 ms | SPI | 6 mm | 8-WSON | 5 mm |
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 75 MHz | 4 Mbit | Surface Mount | Non-Volatile | 8 bit | 512 K | FLASH | 85 °C | -40 °C | 3 ms | 3 ms | SPI | 0.209 in | 8-SOIC | 5.3 mm | |
Winbond Electronics | 3.6 V | 2.3 V | FLASH | 104 MHz | 4 Mbit | Surface Mount | Non-Volatile | 8 bit | 512 K | FLASH | 85 °C | -40 °C | 800 µs | 800 µs | SPI | 0.209 in | 8-SOIC | 5.3 mm | |
Winbond Electronics | 3.6 V | 2.3 V | FLASH | 104 MHz | 4 Mbit | Surface Mount | Non-Volatile | 8-UFDFN Exposed Pad | 8 bit | 512 K | FLASH | 85 °C | -40 °C | 800 µs | 800 µs | SPI | 2 mm | 8-USON | 3 mm |
Winbond Electronics | 3.6 V | 2.3 V | FLASH | 104 MHz | 4 Mbit | Surface Mount | Non-Volatile | 8 bit | 512 K | FLASH | 85 °C | -40 °C | 800 µs | 800 µs | SPI | 0.209 in | 8-SOIC | 5.3 mm | |
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 75 MHz | 4 Mbit | Surface Mount | Non-Volatile | 8-WDFN Exposed Pad | 8 bit | 512 K | FLASH | 85 °C | -40 °C | 3 ms | 3 ms | SPI | 6 mm | 8-WSON | 5 mm |
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 104 MHz | 4 Mbit | Surface Mount | Non-Volatile | 8 bit | 512 K | FLASH | 85 °C | -40 °C | 3 ms | 3 ms | SPI | 0.209 in | 8-SOIC | 5.3 mm | |
Winbond Electronics | 3.6 V | 2.3 V | FLASH | 104 MHz | 4 Mbit | Surface Mount | Non-Volatile | 8 bit | 512 K | FLASH | 85 °C | -40 °C | 800 µs | 800 µs | SPI | 0.154 in | 8-SOIC | 3.9 mm | |
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 75 MHz | 4 Mbit | Surface Mount | Non-Volatile | 8 bit | 512 K | FLASH | 85 °C | -40 °C | 3 ms | 3 ms | SPI | 0.209 in | 8-SOIC | 5.3 mm | |
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 104 MHz | 4 Mbit | Through Hole | Non-Volatile | 8 bit | 512 K | FLASH | 85 °C | -40 °C | 3 ms | 3 ms | SPI | 0.3 in | 8-DIP 8-PDIP | 7.62 mm |