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CONN IC DIP SOCKET 20POS GOLD
| Part | Contact Material - Mating | Pitch - Post | Pitch - Post | Contact Finish - Mating | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Features | Termination Post Length | Termination Post Length | Housing Material | Termination | Number of Positions or Pins (Grid) | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | 2.54 mm | 0.1 in | Gold | Through Hole | 105 ░C | -55 °C | UL94 V-0 | 30 Áin | 0.76 Ám | 3 A | 10 çin | 0.25 çm | DIP | 0.6 in | 15.24 mm | Closed Frame Elevated | 3.56 mm | 0.14 in | Glass Filled Nylon 4/6 Polyamide (PA46) | Solder | 20 | Brass | 0.1 in | 2.54 mm | Gold |