18-1518 Series

Catalog

CONN IC DIP SOCKET 18POS GOLD

Part	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Material - Post [custom]	Type	Type	Type	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Contact Material - Mating	Contact Finish - Post	Housing Material	Termination Post Length	Termination Post Length	Mounting Type	Current Rating (Amps)	Number of Positions or Pins (Grid)	Material Flammability Rating	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 18-1518-10	Gold	10 çin	0.25 çm	Open Frame	Brass	DIP	5.08 mm	0.2 in	0.1 in	2.54 mm	2.54 mm	0.1 in	Beryllium Copper	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	Through Hole	3 A	18	UL94 V-0	Solder	200 µin	5.08 µm
Aries Electronics 18-1518-00	Gold	10 çin	0.25 çm	Open Frame	Brass	DIP	5.08 mm	0.2 in	0.1 in	2.54 mm	2.54 mm	0.1 in	Beryllium Copper	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	Surface Mount	3 A	18	UL94 V-0	Solder	200 µin	5.08 µm
Aries Electronics 18-1518-10H	Gold	10 çin	0.25 çm	Open Frame	Brass	DIP	5.08 mm	0.2 in	0.1 in	2.54 mm	2.54 mm	0.1 in	Beryllium Copper	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	Through Hole	3 A	18	UL94 V-0	Solder	200 µin	5.08 µm