18-1518 Series

Catalog

CONN IC DIP SOCKET 18POS GOLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Contact Finish Thickness - Post	Pitch - Post	Contact Material - Post	Contact Material - Mating	Termination	Contact Finish Thickness - Mating	Pitch - Mating	Housing Material	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Contact Finish - Mating	Features	Row Spacing	Type	Contact Finish - Post	Mounting Type
Aries Electronics 18-1518-10	0.125 in	UL94 V-0	3 A	200 µin	0.1 in	Brass	Beryllium Copper	Solder	10 µin	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	9	2	18	Gold	Open Frame	0.2 in	0.2" (5.08mm) Row Spacing DIP	Tin	Through Hole
Aries Electronics 18-1518-00	0.125 in	UL94 V-0	3 A	200 µin	0.1 in	Brass	Beryllium Copper	Solder	10 µin	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	9	2	18	Gold	Open Frame	0.2 in	0.2" (5.08mm) Row Spacing DIP	Tin	Surface Mount
Aries Electronics 18-1518-10H	0.125 in	UL94 V-0	3 A	200 µin	0.1 in	Brass	Beryllium Copper	Solder	10 µin	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	9	2	18	Gold	Open Frame	0.2 in	0.2" (5.08mm) Row Spacing DIP	Tin	Through Hole